{"id":100,"date":"2026-07-13T09:00:00","date_gmt":"2026-07-13T09:00:00","guid":{"rendered":"https:\/\/rlxsolutions.com\/blog\/?p=100"},"modified":"2026-09-28T18:54:14","modified_gmt":"2026-09-28T18:54:14","slug":"what-is-turnkey-pcb-assembly-and-why-it-matters","status":"publish","type":"post","link":"https:\/\/rlxsolutions.com\/blog\/what-is-turnkey-pcb-assembly-and-why-it-matters\/","title":{"rendered":"Turnkey PCB Assembly From BOM to Finished PCBA"},"content":{"rendered":"<p>\n      Turnkey PCB assembly puts component procurement, bare-board supply, assembly,<br \/>\n      inspection and test under one manufacturing programme instead of splitting<br \/>\n      them among vendors. <a href=\"https:\/\/rlxsolutions.com\/\">RLX Solutions<\/a>, a contract electronics manufacturer in<br \/>\n      Concord, Ontario, uses this model to turn an approved BOM and manufacturing<br \/>\n      package into a finished <a href=\"https:\/\/rlxsolutions.com\/blog\/pcb-assembly-guide\/\">printed circuit board assembly<\/a> ready for shipment.\n    <\/p>\n<p>\n      The convenience is easy to describe. The engineering consequence matters more.\n    <\/p>\n<p>\n      A turnkey contract manufacturer is responsible for coordinating decisions<br \/>\n      that affect each other: whether the bill of materials can actually be sourced,<br \/>\n      whether substitutes change assembly risk, whether the printed circuit board<br \/>\n      stackup supports the package geometry, whether moisture-sensitive parts are<br \/>\n      handled correctly, and whether the inspection plan can see the defects the<br \/>\n      design is likely to produce.\n    <\/p>\n<p>\n      That coordination is what separates turnkey PCB assembly from simply buying<br \/>\n      parts and placing them.\n    <\/p>\n<h2>Turnkey PCB assembly starts with the manufacturing package<\/h2>\n<p>\n      A bill of materials (BOM) tells the manufacturer what components belong on<br \/>\n      the board, but it is not enough to manufacture the assembly by itself. The<br \/>\n      assembly programme also needs the files that define the bare circuit board,<br \/>\n      component locations, orientation and production requirements.\n    <\/p>\n<p>For a complete PCB assembly package, that normally means:<\/p>\n<ul>\n<li>BOM in .xlsx or .csv format<\/li>\n<li>Gerber RS-274X, ODB++ or IPC-2581 fabrication data<\/li>\n<li>NC drill files<\/li>\n<li>Pick-and-place or centroid data<\/li>\n<li>Assembly drawing<\/li>\n<li>Stackup information where relevant<\/li>\n<li>Impedance targets where controlled impedance is required<\/li>\n<li>Fabrication notes and assembly notes<\/li>\n<\/ul>\n<p>\n      An engineer-reviewed design for manufacturability and design for assembly<br \/>\n      (DFM\/DFA) review matters here because discrepancies tend to propagate. If the<br \/>\n      BOM calls for a 0.5 mm pitch device but the centroid data uses an outdated<br \/>\n      footprint revision, purchasing may acquire the correct part while assembly<br \/>\n      receives incorrect placement data.\n    <\/p>\n<p>\n      Version control therefore becomes a manufacturing issue, not an administrative<br \/>\n      one. The BOM, PCB fabrication data, assembly drawing and placement file need<br \/>\n      to describe the same revision.\n    <\/p>\n<h3>Worked example: one wrong revision can cross three departments<\/h3>\n<p>\n      Consider an eight-layer board that has been revised from a 0.8 mm pitch BGA<br \/>\n      to a 0.5 mm pitch replacement.\n    <\/p>\n<p>\n      Revision A of the BOM lists the old BGA. Revision B lists the replacement.<br \/>\n      The PCB layout was updated for Revision B, but the pick-and-place file was<br \/>\n      accidentally exported from Revision A.\n    <\/p>\n<p>\n      The bare board may fabricate correctly. Procurement may also buy the intended<br \/>\n      Revision B device. The problem appears during programming, placement review<br \/>\n      or first article inspection because the manufacturing files disagree.\n    <\/p>\n<p>\n      Turnkey assembly reduces the number of commercial handoffs, but it does not<br \/>\n      remove the need for disciplined release control. A manufacturer still needs<br \/>\n      one coherent package before procurement and production begin.\n    <\/p>\n<h2>Component procurement is part of the engineering risk<\/h2>\n<p>\n      Turnkey assembly means the manufacturer procures the components rather than<br \/>\n      waiting for a customer-supplied kit. That shifts more responsibility upstream,<br \/>\n      where availability, date codes, packaging condition and authenticity can<br \/>\n      affect whether the board reaches the line at all.\n    <\/p>\n<p>\n      <a href=\"https:\/\/rlxsolutions.com\/component-procurement.html\">Authorized distribution<\/a> is usually the cleanest sourcing path because<br \/>\n      provenance is easier to establish. Supply constraints, obsolete devices or<br \/>\n      end-of-life parts can require other channels, including vetted independent<br \/>\n      distribution, excess inventory or global sourcing networks.\n    <\/p>\n<p>\n      The important distinction is not simply where the part was bought. It is how<br \/>\n      the source and the material are verified.\n    <\/p>\n<p>\n      A counterfeit-prevention workflow can include source vetting, packaging<br \/>\n      inspection, checking date code and country-of-origin information, visual<br \/>\n      inspection to IDEA-STD-1010 criteria, lot verification, X-ray examination,<br \/>\n      electrical testing and, where risk warrants escalation, third-party<br \/>\n      decapsulation and die analysis.\n    <\/p>\n<p>\n      That process becomes especially relevant when a BOM contains an obsolete<br \/>\n      microcontroller, allocated power device or legacy connector that cannot be<br \/>\n      obtained through normal authorized channels.\n    <\/p>\n<p>\n      Moisture-sensitive devices add another requirement. Packaging condition,<br \/>\n      dry storage and handling need to be controlled according to IPC\/JEDEC<br \/>\n      J-STD-033 practices so a genuine component is not damaged before it is even<br \/>\n      placed.\n    <\/p>\n<h2>Bare PCB fabrication can change the assembly plan<\/h2>\n<p>\n      Turnkey PCB assembly does not begin at the placement machine. The bare PCB<br \/>\n      is the mechanical and electrical foundation for every solder joint that<br \/>\n      follows.\n    <\/p>\n<p>\n      Board stackup, copper weight, via architecture, surface finish, solder mask<br \/>\n      geometry and controlled impedance requirements all influence fabrication.<br \/>\n      Several of those choices also change what assembly inspection needs to verify.\n    <\/p>\n<p>\n      For example, a design using via-in-pad plated over fill places filled, capped<br \/>\n      and planarized vias directly beneath component pads. That may be useful for<br \/>\n      dense ball grid array (BGA) fanout, but the fabrication process has to produce<br \/>\n      a flat solderable pad before solder paste is printed.\n    <\/p>\n<p>\n      Blind vias create another dependency. On a four-layer or greater stackup,<br \/>\n      blind-via construction requires sequential lamination. If the designer decides<br \/>\n      late in the release cycle to replace through vias with Layer 1 to Layer 2<br \/>\n      blind vias, the change is not just a drill-file update. It changes how the<br \/>\n      bare board is built.\n    <\/p>\n<p>\n      Aspect ratio also matters for mechanically drilled plated holes. As board<br \/>\n      thickness rises or finished-hole diameter falls, plating becomes harder to<br \/>\n      maintain through the full barrel. A fabrication review therefore has to<br \/>\n      consider hole geometry and board thickness together rather than treating<br \/>\n      minimum drill size as an isolated number.\n    <\/p>\n<h3>Board A versus Board B: same layer count, different manufacturing cost<\/h3>\n<p>\n      Consider two hypothetical 10-layer, 1.6 mm printed circuit boards of the<br \/>\n      same overall dimensions.\n    <\/p>\n<table>\n<thead>\n<tr>\n<th>Decision factor<\/th>\n<th>Board A<\/th>\n<th>Board B<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Layer count<\/td>\n<td>10 layers<\/td>\n<td>10 layers<\/td>\n<\/tr>\n<tr>\n<td>Via structure<\/td>\n<td>Through-hole vias<\/td>\n<td>Layer 1 to 2 microvias, Layer 2 to 3 microvias and buried inner-layer vias<\/td>\n<\/tr>\n<tr>\n<td>Smallest via type<\/td>\n<td>Mechanically drilled PTH<\/td>\n<td>0.10 mm laser-drilled microvias<\/td>\n<\/tr>\n<tr>\n<td>Lamination<\/td>\n<td>Conventional multilayer build<\/td>\n<td>Sequential lamination<\/td>\n<\/tr>\n<tr>\n<td>BGA fanout<\/td>\n<td>Through-via fanout<\/td>\n<td>HDI fanout<\/td>\n<\/tr>\n<tr>\n<td>Via-in-pad<\/td>\n<td>No<\/td>\n<td>Filled, capped and planarized pads in selected BGA area<\/td>\n<\/tr>\n<tr>\n<td>Fabrication consequence<\/td>\n<td>Fewer build stages<\/td>\n<td>More drilling, filling, plating and lamination operations<\/td>\n<\/tr>\n<tr>\n<td>Assembly consequence<\/td>\n<td>Conventional paste-printing surface<\/td>\n<td>Pad planarity becomes important beneath the BGA<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>\n      The layer count is identical, but Board B contains more manufacturing stages<br \/>\n      and more interfaces where variation can enter.\n    <\/p>\n<p>\n      That is why PCB assembly pricing cannot be inferred from layer count alone.<br \/>\n      The stackup and interconnect architecture determine how difficult the bare<br \/>\n      board is to manufacture before a component reaches it.\n    <\/p>\n<h2>Solder paste inspection catches problems before reflow<\/h2>\n<p>\n      Surface-mount assembly begins with solder paste deposition through a stencil.<br \/>\n      For dense assemblies, the amount and position of paste can determine whether<br \/>\n      a solder joint ever has a chance to form correctly.\n    <\/p>\n<p>\n      Solder paste inspection (SPI) measures paste volume, area and offset before<br \/>\n      the components enter reflow. Checking paste before reflow is important because<br \/>\n      a downstream inspection system can identify a solder defect, but it cannot<br \/>\n      recover the production time already spent placing and reflowing a bad print.\n    <\/p>\n<p>This becomes more significant as pad dimensions shrink.<\/p>\n<p>\n      Imagine a board carrying 01005 passives and a 0.3 mm pitch BGA. The assembly<br \/>\n      process is now sensitive to small changes in paste deposition, pad alignment<br \/>\n      and component placement. A print problem repeated across a panel can create<br \/>\n      dozens of downstream defects from one upstream cause.\n    <\/p>\n<p>SPI therefore works as process control, not just defect detection.<\/p>\n<h2>Placement and reflow convert the bare board into a PCBA<\/h2>\n<p>\n      Once paste deposition is verified, surface-mount technology (SMT) components<br \/>\n      are placed according to the centroid data and assembly programming. The<br \/>\n      populated board then passes through reflow so the solder paste forms<br \/>\n      metallurgical joints between component terminations and PCB pads.\n    <\/p>\n<p>\n      A printed circuit board assembly, commonly shortened to PCBA, is the populated<br \/>\n      board after electronic components have been attached. Mixed-technology<br \/>\n      assemblies may combine SMT with through-hole parts, press-fit components or<br \/>\n      selective soldering.\n    <\/p>\n<p>\n      Package geometry changes how much of the resulting connection can be inspected<br \/>\n      visually.\n    <\/p>\n<p>\n      A chip resistor exposes its solder joints around the perimeter. A BGA hides<br \/>\n      its joints beneath the package. A quad flat no-lead (QFN) package may include<br \/>\n      a large thermal pad that is also hidden once the device is placed.\n    <\/p>\n<p>\n      That difference determines the inspection method required after reflow.\n    <\/p>\n<h2>Inspection needs to match the package, not just the board<\/h2>\n<p>\n      Automated optical inspection (AOI) is useful after reflow for visible<br \/>\n      placement and solder conditions on both sides of the PCB. It can identify<br \/>\n      issues such as missing parts, polarity errors and visible solder-joint defects.\n    <\/p>\n<p>\n      AOI cannot directly see a solder joint hidden beneath a BGA or land grid array<br \/>\n      (LGA). Automated X-ray inspection (AXI) addresses that blind spot by examining<br \/>\n      internal solder features, including BGA and LGA joints and QFN thermal pads.\n    <\/p>\n<p>\n      The mechanism matters. Optical inspection evaluates light reflected from<br \/>\n      visible features. X-ray imaging evaluates density through the assembly.<br \/>\n      Hidden-joint packages therefore require a different observation method.\n    <\/p>\n<p>\n      For a board with a 0.3 mm pitch BGA, inspection strategy should be decided<br \/>\n      before production rather than after a failure appears. Package selection and<br \/>\n      test coverage are connected design decisions.\n    <\/p>\n<p>\n      Manual visual inspection still has a role. Boards can be inspected under<br \/>\n      magnification against IPC-A-610 Class 2 or Class 3 workmanship requirements,<br \/>\n      depending on the programme.\n    <\/p>\n<p>\n      Class 3 does not simply mean that an inspector looks harder. It applies<br \/>\n      tighter workmanship expectations and documentation requirements, so the build<br \/>\n      class should be agreed before manufacturing documentation and acceptance<br \/>\n      criteria are finalized.\n    <\/p>\n<h2>First article approval creates a controlled production baseline<\/h2>\n<p>\n      The first article is the first completed build used to verify that the released<br \/>\n      files, materials and manufacturing process produce the intended assembly.\n    <\/p>\n<p>\n      This is the point where a programme can catch a systematic error before the<br \/>\n      full lot follows it.\n    <\/p>\n<p>\n      Suppose a 200-board order contains a polarized connector rotated 180 degrees<br \/>\n      in the assembly drawing while the PCB silkscreen and design database show the<br \/>\n      intended orientation. If production begins without resolving that conflict,<br \/>\n      the same error can be repeated across the lot.\n    <\/p>\n<p>\n      A first article inspection (FAI) interrupts that path. On a new build, the<br \/>\n      initial assembly can be reviewed and customer approval obtained before<br \/>\n      production lot release.\n    <\/p>\n<p>\n      The economic value is straightforward. Discovering one systemic issue on the<br \/>\n      first unit is different from discovering the same issue after 200 units have<br \/>\n      been assembled.\n    <\/p>\n<h2>Electrical test answers a different question from visual inspection<\/h2>\n<p>\n      Inspection asks whether the board appears to have been manufactured correctly.<br \/>\n      Electrical test asks whether its electrical network or intended functions<br \/>\n      behave correctly.\n    <\/p>\n<p>Those are related but separate questions.<\/p>\n<p>\n      Flying-probe in-circuit test (ICT) is suited to prototype and lower-volume<br \/>\n      work because it can contact test points without a dedicated bed-of-nails<br \/>\n      fixture. It can provide full net coverage where the board has been designed<br \/>\n      for the required access.\n    <\/p>\n<p>\n      At production volume, bed-of-nails ICT can use a dedicated fixture to make<br \/>\n      simultaneous electrical contact across the board.\n    <\/p>\n<p>\n      Functional test (FCT) moves beyond connectivity. It exercises the assembly<br \/>\n      according to a customer-defined specification and records pass or fail<br \/>\n      results. Depending on the product, that may involve powering rails,<br \/>\n      communicating with interfaces, operating loads, verifying programmed<br \/>\n      functions or checking sensor behaviour.\n    <\/p>\n<p>\n      A board can pass AOI and still fail electrically. It can also pass continuity<br \/>\n      checks while failing its intended function. Inspection, ICT and FCT therefore<br \/>\n      answer different failure questions.\n    <\/p>\n<h2>Programming, serialization and finishing belong in the build plan<\/h2>\n<p>\n      Many finished assemblies require work after soldering and inspection.\n    <\/p>\n<p>\n      In-system programming can load firmware through interfaces such as JTAG, SWD,<br \/>\n      ISP or ICSP. Programming can also include bootloader installation or firmware<br \/>\n      flashing.\n    <\/p>\n<p>\n      Serialization associates a physical assembly with a unique identity. Serial<br \/>\n      marking, programmed MAC addresses, labels or laser marks can then connect<br \/>\n      that board to production and test records.\n    <\/p>\n<p>\n      Those steps matter when troubleshooting moves from the production line into<br \/>\n      field service. If a failed unit can be tied back to its material lots,<br \/>\n      programmed configuration and test results, failure analysis starts with<br \/>\n      evidence rather than reconstruction.\n    <\/p>\n<p>\n      Other post-assembly processes can include conformal coating, underfill,<br \/>\n      potting, encapsulation, press-fit insertion, selective soldering and BGA<br \/>\n      rework. These should be specified before production because they affect<br \/>\n      routing through the factory.\n    <\/p>\n<p>\n      For example, conformal coating applied after electrical test creates a<br \/>\n      protective layer over the completed assembly. If a board will later require<br \/>\n      connector mating, probe access or adjustment, those keep-out areas must be<br \/>\n      defined before coating.\n    <\/p>\n<h2>Turnkey, kitted and consigned assembly solve different sourcing problems<\/h2>\n<p>\n      Turnkey <a href=\"https:\/\/rlxsolutions.com\/pcb-assembly.html\">PCB assembly<\/a> is one of three common material models.\n    <\/p>\n<table>\n<thead>\n<tr>\n<th>Decision factor<\/th>\n<th>Turnkey<\/th>\n<th>Kitted or partial turnkey<\/th>\n<th>Consigned<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Component purchasing<\/td>\n<td>Manufacturer buys the BOM<\/td>\n<td>Customer supplies selected parts, manufacturer buys the rest<\/td>\n<td>Customer supplies the complete kit<\/td>\n<\/tr>\n<tr>\n<td>Bare PCB<\/td>\n<td>Manufacturer fabricates or sources<\/td>\n<td>Programme-dependent<\/td>\n<td>Programme-dependent<\/td>\n<\/tr>\n<tr>\n<td>Best fit<\/td>\n<td>Customer wants one accountable manufacturing programme<\/td>\n<td>Customer controls critical or long-lead items<\/td>\n<td>Customer already owns the complete material set<\/td>\n<\/tr>\n<tr>\n<td>Main coordination issue<\/td>\n<td>Supplier manages sourcing and production dependencies<\/td>\n<td>Ownership must be clear for every BOM line<\/td>\n<td>Kit completeness and material condition become central<\/td>\n<\/tr>\n<tr>\n<td>Buyer workload<\/td>\n<td>Lowest material-management burden<\/td>\n<td>Shared<\/td>\n<td>Highest pre-build material responsibility<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>\n      Turnkey is strongest when the objective is to transfer component purchasing<br \/>\n      and production coordination to the contract manufacturer.\n    <\/p>\n<p>\n      Partial turnkey makes sense when the customer must control selected<br \/>\n      components. A design team might, for example, consign a programmed security<br \/>\n      device or a scarce processor while asking the manufacturer to procure standard<br \/>\n      resistors, capacitors, connectors and the remaining BOM.\n    <\/p>\n<p>\n      <a href=\"https:\/\/rlxsolutions.com\/blog\/turnkey-vs-kitted-vs-consigned-pcb-assembly\/\">Consigned assembly<\/a> shifts sourcing responsibility back to the customer. That<br \/>\n      can be useful when material is already owned, but a missing reel or mismatched<br \/>\n      quantity can stop the build because the assembler cannot simply treat the BOM<br \/>\n      as a purchasing requirement.\n    <\/p>\n<p>\n      The decision therefore concerns ownership of material risk as much as<br \/>\n      purchasing convenience.\n    <\/p>\n<h2>A complete quote should expose manufacturing dependencies early<\/h2>\n<p>\n      Turnkey PCB assembly works best when commercial quoting and engineering review<br \/>\n      happen from the same release package.\n    <\/p>\n<p>\n      A low component price does not help if the chosen alternate changes package<br \/>\n      geometry. A low bare-board price does not help if a surface finish is poorly<br \/>\n      matched to the assembly process. A fast component purchase does not help if<br \/>\n      the fabrication data still contains unresolved stackup questions.\n    <\/p>\n<p>\n      For procurement teams, this is where the contract manufacturing model earns<br \/>\n      its value. One programme owner can coordinate BOM sourcing, PCB fabrication,<br \/>\n      assembly, first article review, inspection and test without forcing the buyer<br \/>\n      to reconcile separate supplier assumptions.\n    <\/p>\n<p>\n      For engineers, the requirement is equally practical: release enough<br \/>\n      information for those dependencies to be reviewed before purchase orders<br \/>\n      lock them in.\n    <\/p>\n<h2>What to send for a turnkey PCB assembly quote<\/h2>\n<p>\n      If the goal is a quote that can progress into manufacturing without a second<br \/>\n      documentation cycle, send the complete release package rather than the BOM<br \/>\n      alone.\n    <\/p>\n<p>\n      Include the BOM, fabrication data, NC drill, pick-and-place file and assembly<br \/>\n      drawing. Add the stackup and impedance requirements where they apply, and<br \/>\n      include fabrication or assembly notes that affect acceptance.\n    <\/p>\n<p>\n      Also identify the required workmanship class and provide the functional test<br \/>\n      specification if FCT is part of the programme.\n    <\/p>\n<p>\n      If programming is required, include the firmware package and programming<br \/>\n      instructions. If serial numbers, MAC addresses or labels must follow a<br \/>\n      particular format, define that before the first article.\n    <\/p>\n<p>\n      These inputs let the manufacturer review the board as a manufacturing system<br \/>\n      rather than as disconnected purchasing and assembly tasks.\n    <\/p>\n<h2>From files to a production-ready build<\/h2>\n<p>\n      If you are preparing a turnkey build, RLX reviews the manufacturing package<br \/>\n      as part of every quote. Send the Gerbers or other accepted fabrication data,<br \/>\n      BOM, pick-and-place file and assembly drawing so sourcing, bare-board<br \/>\n      fabrication, assembly requirements and engineer-reviewed DFM\/DFA feedback can<br \/>\n      be evaluated together.\n    <\/p>\n<section class=\"faq\">\n<h2>Frequently Asked Questions<\/h2>\n<h3>What does turnkey PCB assembly include?<\/h3>\n<p>\n        Turnkey PCB assembly means the manufacturer procures the components,<br \/>\n        fabricates or sources the bare PCBs, assembles the boards, performs the<br \/>\n        specified inspection and test, and ships the completed assemblies. The<br \/>\n        customer supplies the design and manufacturing package rather than sourcing<br \/>\n        and shipping every production component as a complete kit.\n      <\/p>\n<h3>What files are needed for turnkey PCB assembly?<\/h3>\n<p>\n        A complete package normally includes the BOM, Gerber RS-274X, ODB++ or<br \/>\n        IPC-2581 fabrication data, NC drill files, pick-and-place or centroid data<br \/>\n        and an assembly drawing. Stackup information, impedance targets, fabrication<br \/>\n        notes, programming files and functional test requirements should also be<br \/>\n        supplied when they apply to the design.\n      <\/p>\n<h3>Can a turnkey manufacturer source obsolete electronic components?<\/h3>\n<p>\n        Yes. Obsolete and end-of-life components can be sourced through channels<br \/>\n        beyond current authorized distribution, including excess inventory and<br \/>\n        specialised sourcing networks. The sourcing route should be paired with an<br \/>\n        authenticity plan that can include source vetting, packaging checks,<br \/>\n        IDEA-STD-1010 visual inspection, X-ray, electrical testing and further<br \/>\n        analysis where required.\n      <\/p>\n<h3>What is the difference between AOI and X-ray inspection?<\/h3>\n<p>\n        Automated optical inspection checks visible component placement and solder<br \/>\n        features after reflow. X-ray inspection can evaluate solder connections<br \/>\n        hidden beneath packages such as BGAs and LGAs and can examine QFN thermal<br \/>\n        pads. A board with hidden-joint packages therefore requires inspection<br \/>\n        coverage that does not rely on visible solder fillets alone.\n      <\/p>\n<h3>Do I need functional testing if the board already receives ICT?<\/h3>\n<p>\n        They serve different purposes. In-circuit testing checks electrical networks<br \/>\n        and can detect issues such as opens or shorts. Functional testing operates<br \/>\n        the assembly against a customer-defined specification and records whether<br \/>\n        the intended functions work. A board can have correct net connectivity yet<br \/>\n        still fail firmware, interface, power or system-level behaviour.\n      <\/p>\n<h3>When should I choose partial turnkey instead of full turnkey?<\/h3>\n<p>\n        Partial turnkey is useful when you need to retain control of selected<br \/>\n        components while asking the manufacturer to source the remainder of the<br \/>\n        BOM. Typical reasons include customer-owned inventory, scarce parts or<br \/>\n        devices that require programme-specific control. The important step is<br \/>\n        assigning sourcing responsibility clearly to every BOM line before<br \/>\n        purchasing starts.\n      <\/p>\n<\/section>\n","protected":false},"excerpt":{"rendered":"<p>Turnkey PCB assembly puts component procurement, bare-board supply, assembly, inspection and test under one manufacturing programme instead of splitting them [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":195,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"nf_dc_page":"","site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[17],"tags":[],"class_list":["post-100","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-assembly"],"_links":{"self":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/100","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/comments?post=100"}],"version-history":[{"count":4,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/100\/revisions"}],"predecessor-version":[{"id":196,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/100\/revisions\/196"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/media\/195"}],"wp:attachment":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/media?parent=100"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/categories?post=100"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/tags?post=100"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}