{"id":116,"date":"2026-07-11T09:00:00","date_gmt":"2026-07-11T09:00:00","guid":{"rendered":"https:\/\/rlxsolutions.com\/blog\/?p=116"},"modified":"2026-09-28T18:54:06","modified_gmt":"2026-09-28T18:54:06","slug":"rigid-vs-flex-vs-rigid-flex-pcb-how-to-choose","status":"publish","type":"post","link":"https:\/\/rlxsolutions.com\/blog\/rigid-vs-flex-vs-rigid-flex-pcb-how-to-choose\/","title":{"rendered":"Rigid, Flex & Rigid-Flex PCB: Differences, Uses & Manufacturing"},"content":{"rendered":"

\n Rigid, flex and rigid-flex PCBs solve different mechanical and electrical packaging problems.
\n Rigid boards provide a fixed structure, flex circuits bend through constrained spaces, and
\n rigid-flex combines both in one interconnected construction. RLX Solutions<\/a>, a contract
\n electronics manufacturer in Concord, Ontario, evaluates PCB architecture against the
\n electrical, mechanical and manufacturing requirements of the design.\n <\/p>\n

\n The distinction matters long before fabrication. Changing from rigid to flex is not simply
\n a substrate substitution. It changes conductor geometry, bend-zone layout, material behaviour,
\n panel handling, assembly support and the way mechanical loads reach copper.\n <\/p>\n

\n Rigid-flex goes further. It replaces connectors or cable assemblies between rigid sections
\n with integral flexible interconnects. That can reduce interconnect hardware and packaging
\n volume, but it also makes the layer construction and manufacturing sequence more dependent
\n on the mechanical design.\n <\/p>\n<\/header>\n

\n

Rigid vs Flex vs Rigid-Flex PCB at a Glance<\/h2>\n\n\n\n\n\n\n\n\n\n\n\n\n
Decision factor<\/th>\nRigid PCB<\/th>\nFlex PCB<\/th>\nRigid-flex PCB<\/th>\n<\/tr>\n<\/thead>\n
Mechanical form<\/th>\nFixed planar structure<\/td>\nBendable circuit<\/td>\nRigid sections joined by flexible sections<\/td>\n<\/tr>\n
Typical design reason<\/th>\nStable component mounting<\/td>\nSpace, motion or folded routing<\/td>\nIntegrated 3D electronic packaging<\/td>\n<\/tr>\n
Component placement<\/th>\nUsually on rigid board area<\/td>\nPossible, but local mechanical support matters<\/td>\nUsually concentrated on rigid regions<\/td>\n<\/tr>\n
Interconnection<\/th>\nBoard traces plus connectors or cables where required<\/td>\nCopper traces travel through the flex<\/td>\nFlex layers connect rigid sections directly<\/td>\n<\/tr>\n
Bend behaviour<\/th>\nNot intended to bend in service<\/td>\nCan be static or dynamic depending on design<\/td>\nFlex sections provide controlled movement or folding<\/td>\n<\/tr>\n
Stackup sensitivity<\/th>\nDriven mainly by electrical and fabrication requirements<\/td>\nElectrical plus mechanical-neutral-axis requirements<\/td>\nElectrical, mechanical and lamination requirements interact<\/td>\n<\/tr>\n
Manufacturing impact<\/th>\nConventional rigid-board process flow<\/td>\nFlexible-material handling and bend-zone control<\/td>\nMultiple material regions and a more involved build sequence<\/td>\n<\/tr>\n
Design-change cost<\/th>\nOften localized to the PCB<\/td>\nCan affect bend geometry and enclosure fit<\/td>\nCan affect rigid boards, flex geometry and layer construction together<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

\n A rigid PCB is usually the simplest architecture when the enclosure can accommodate a flat
\n board and conventional interconnects.\n <\/p>\n

\n Flex earns its place when the interconnect itself has to bend, fold, move through a hinge
\n or fit around mechanical obstacles.\n <\/p>\n

\n Rigid-flex is most useful when separate rigid boards and their interconnecting cables would
\n otherwise consume space, add connectors or complicate final assembly.\n <\/p>\n<\/section>\n

\n

The Structural Difference Changes How Copper Behaves<\/h2>\n

\n Rigid PCB conductors are supported by a comparatively stiff laminate system. Flex conductors
\n operate in a structure intended to deform, which makes strain distribution a first-order
\n design variable.\n <\/p>\n

\n When a flex section bends, material on the outside of the bend stretches while material on
\n the inside compresses. Somewhere between those surfaces is a neutral axis where longitudinal
\n strain approaches zero. Copper positioned and routed with that behaviour in mind experiences
\n less cyclic strain than copper placed poorly within the bend construction.\n <\/p>\n

\n That is why flex routing cannot be treated like ordinary rigid-board routing on a softer sheet.\n <\/p>\n

\n A trace crossing a bend zone at an angle, a sudden width transition, a via near the bend or
\n a copper feature that locally stiffens the circuit can concentrate strain. The electrical
\n drawing may still look correct, but the mechanical loading has changed.\n <\/p>\n

\n Rigid-flex adds another interface: the transition between a rigid section and the flexible
\n section. That region needs controlled geometry because the stiffness changes abruptly.
\n Mechanical load should not be concentrated at the same location as vulnerable copper
\n transitions, holes or other local discontinuities.\n <\/p>\n<\/section>\n

\n

Use Rigid PCBs When Mechanical Stability Is an Asset<\/h2>\n

\n A rigid circuit board remains the default choice for a large share of electronics because
\n it gives components, solder joints and connectors a stable mechanical platform.\n <\/p>\n

\n It works well when the design can satisfy enclosure, connector and assembly requirements
\n without requiring the PCB itself to bend.\n <\/p>\n

\n Rigid construction also leaves the designer with familiar fabrication variables such as
\n layer count, copper weight, drill geometry, trace spacing, impedance structure and surface
\n finish<\/a>. Those variables can still make a rigid board difficult to build, but the board does
\n not need to perform a second job as a mechanical interconnect.\n <\/p>\n

\n Consider a hypothetical six-layer, 1.6 mm board carrying a ball grid array (BGA), power stages
\n and board-to-wire connectors. If the enclosure gives the board enough planar area, keeping the
\n design rigid avoids adding bend-zone rules and flexible-material interfaces simply to solve
\n a packaging problem that does not exist.\n <\/p>\n

\n The more demanding question may instead be via architecture. A 0.20 mm finished through hole
\n in a 1.6 mm board has an 8:1 thickness-to-hole relationship. Moving to much smaller drilled
\n holes without changing board thickness pushes the fabrication process harder because plating
\n must reach reliably through a deeper, narrower barrel.\n <\/p>\n

\n For dense BGA escape, microvias or via-in-pad may become relevant. Via-in-pad with plated-over
\n fill uses resin fill, copper capping and planarization so the component pad remains a solderable
\n surface rather than an open via cavity.\n <\/p>\n

\n That manufacturing decision is separate from whether the board needs to flex.\n <\/p>\n<\/section>\n

\n

Flex PCB Design Starts With the Bend, Not the Outline<\/h2>\n

\n A flex circuit should be designed around its mechanical duty before traces are finalized.\n <\/p>\n

\n There are two fundamentally different conditions. A flex tail may bend once during installation
\n and then remain stationary, or it may move repeatedly throughout the product’s operating life.
\n Those two cases impose different fatigue demands even if their finished shapes appear identical.\n <\/p>\n

\n The bend zone should therefore be treated as functional geometry.\n <\/p>\n

\n Assume a hypothetical two-layer flex circuit passes through a 180-degree fold inside an enclosure.
\n One design sends eight parallel traces directly across a 20 mm-long bend region with gradual width
\n transitions. Another introduces vias and changes trace direction inside that same bend because the
\n routing was completed before the mechanical fold was defined.\n <\/p>\n

\n Both may pass an initial electrical continuity test. The second geometry introduces more local
\n stiffness changes and stress concentration points precisely where copper is being strained.\n <\/p>\n

\n The likely failure does not begin as an obvious open circuit. Repeated strain can initiate cracking
\n in copper at a local high-stress location. Electrical resistance may become intermittent before the
\n conductor separates completely, making the mechanical geometry part of electrical reliability.\n <\/p>\n

\n Component mass matters for the same reason. A connector or larger package mounted on an unsupported
\n flexible area can load the copper and solder joints as the circuit moves. Mechanical support,
\n stiffeners and component placement should therefore be resolved with the enclosure rather than
\n after routing.\n <\/p>\n<\/section>\n

\n

Rigid-Flex Removes Interconnects but Adds Manufacturing Dependency<\/h2>\n

\n Rigid-flex PCB construction combines rigid component-bearing sections with integral flexible
\n interconnect regions.\n <\/p>\n

\n The benefit is architectural. Instead of using two rigid boards, two connectors and a separate
\n cable between them, the designer can route the electrical connection through flex layers that
\n continue between the rigid regions.\n <\/p>\n

\n That can simplify the finished assembly, especially where boards must sit at different angles
\n or inside compact three-dimensional packaging.\n <\/p>\n

\n The trade-off is that formerly independent design decisions become linked. The position of one
\n rigid section, the flex length between sections, layer usage, bend direction and assembly sequence
\n now influence one another.\n <\/p>\n

Worked Example: Two 8-Layer Products, Different Cost Drivers<\/h3>\n

Consider two hypothetical eight-layer electronic assemblies.<\/p>\n\n\n\n\n\n\n\n\n\n\n\n
Factor<\/th>\nBoard A<\/th>\nBoard B<\/th>\n<\/tr>\n<\/thead>\n
Layer count<\/th>\n8<\/td>\n8<\/td>\n<\/tr>\n
Architecture<\/th>\nSingle rigid PCB<\/td>\nTwo rigid regions joined by flex<\/td>\n<\/tr>\n
Inter-board connection<\/th>\nExternal connector and cable<\/td>\nIntegral flexible interconnect<\/td>\n<\/tr>\n
Component areas<\/th>\nOne planar board<\/td>\nComponents concentrated on rigid sections<\/td>\n<\/tr>\n
Mechanical requirement<\/th>\nFixed installation<\/td>\nFolded installation<\/td>\n<\/tr>\n
Build dependency<\/th>\nPrimarily rigid stackup and drilling<\/td>\nStackup plus rigid-to-flex transitions and flex geometry<\/td>\n<\/tr>\n
Assembly impact<\/th>\nSeparate cable mating operation<\/td>\nIntegrated board must be formed into final position<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

\n Layer count alone therefore does not predict manufacturing effort.\n <\/p>\n

\n Board A may use complex drilling or controlled impedance, but its physical construction remains
\n rigid. Board B has the same nominal layer count yet must create both rigid and flexible regions
\n within a coordinated construction. Material transitions, lamination sequence, mechanical
\n registration and flex handling become part of the manufacturing problem.\n <\/p>\n

\n The point is not that eight-layer rigid-flex always costs more by a fixed amount. It is that
\n quoting by layer count misses the process steps that actually distinguish the builds.\n <\/p>\n<\/section>\n

\n

How Manufacturing Changes Across the Three Architectures<\/h2>\n

\n Rigid, flex and rigid-flex all begin with an electrical interconnection requirement, but their
\n manufacturing paths diverge once mechanical behaviour enters the design.\n <\/p>\n

Rigid PCB Manufacturing<\/h3>\n

\n A rigid multilayer board is built by creating conductor patterns on individual layers, preparing
\n inner-layer structures, laminating the stack, drilling holes, metallizing and plating those holes,
\n imaging outer conductors and applying final protective and surface treatments.\n <\/p>\n

\n Drilling architecture can change that sequence substantially.\n <\/p>\n

\n A conventional plated through-hole passes through the finished stack. A buried via connects inner
\n layers without reaching the outer surfaces. A blind via terminates within the stack. Microvias are
\n laser-drilled features typically used where routing density demands smaller inter-layer connections.\n <\/p>\n

\n Blind and buried structures require the manufacturer to create and connect features before the
\n entire board is fully laminated. That is why two boards with the same layer count can follow
\n different process routes.\n <\/p>\n

Flex PCB Manufacturing<\/h3>\n

\n Flex manufacturing must preserve circuit geometry while working with a construction intended to move.\n <\/p>\n

\n Material handling becomes more sensitive because thin flexible panels do not behave like rigid sheets
\n during imaging, registration, drilling and plating. Coverlay or other flexible dielectric structures
\n also perform the protective function that solder mask provides across much of a rigid board.\n <\/p>\n

\n Mechanical details remain inseparable from fabrication details. Bend-zone copper, transition geometry,
\n stiffened areas and component locations all influence whether the fabricated circuit can tolerate
\n installation and operation.\n <\/p>\n

Rigid-Flex Manufacturing<\/h3>\n

\n Rigid-flex combines those process concerns and introduces selective construction.\n <\/p>\n

\n Some regions must become structurally rigid while others must remain free to bend. The build sequence
\n must create the required electrical connections without trapping or damaging the flexible portions.\n <\/p>\n

\n This makes stackup documentation particularly important. Layer identity cannot be ambiguous when some
\n conductors continue through flexible regions while other layers exist only within rigid sections.\n <\/p>\n

\n A designer who sends only electrical Gerbers without clearly communicating the intended layer
\n construction leaves the fabricator to infer mechanical information that should have been controlled
\n at design release.\n <\/p>\n<\/section>\n

\n

Via Architecture Can Decide Whether the Board Is Manufacturable<\/h2>\n

\n Vias become more sensitive as routing density increases because they consume both vertical and
\n horizontal routing resources.\n <\/p>\n

\n Through holes are efficient when space permits, but they occupy the entire thickness of a multilayer
\n board even if the electrical connection only needs two nearby layers. Blind, buried and microvia
\n structures can free routing channels, but they alter the fabrication sequence.\n <\/p>\n

\n For example, imagine a hypothetical 10-layer board.\n <\/p>\n

\n One version uses through vias only. Another needs Layer 1 to Layer 2 laser microvias, Layer 2 to
\n Layer 3 microvias and a buried connection between Layer 3 and Layer 8 to escape a dense BGA field.\n <\/p>\n

\n Both are 10-layer PCBs. The second board requires a materially different interconnect strategy because
\n the manufacturer must build those connections into the stack rather than drill every via after final
\n lamination.\n <\/p>\n

\n Stacked microvias also place one small via directly above another. Staggered microvias offset the
\n features laterally. Those geometries affect how loads move through the plated structure and how the
\n layers are built.\n <\/p>\n

\n If a BGA uses via-in-pad, filling and capping are adjacent requirements. Leaving a via open in a
\n solderable pad creates a path that can draw solder away from the intended joint. Filling, planarizing
\n and capping the feature restores a continuous pad surface for assembly.\n <\/p>\n<\/section>\n

\n

Assembly Changes Once the Circuit Board Can Move<\/h2>\n

\n Flexibility changes more than bare-board fabrication<\/a>. It also changes how the assembled circuit is
\n supported during component placement, soldering, inspection and final integration.\n <\/p>\n

\n Surface-mount assembly equipment expects controlled board position. A flexible area may therefore
\n require temporary support or tooling so the populated regions remain stable during printing,
\n placement and reflow.\n <\/p>\n

\n Inspection also needs to match the package types being assembled. Solder paste inspection (SPI)
\n checks deposited paste before reflow. Automated optical inspection (AOI) checks visible post-reflow
\n conditions. Packages such as BGAs, land grid arrays (LGAs) and quad flat no-lead (QFN) devices can
\n require X-ray because critical joints are hidden beneath the package.\n <\/p>\n

\n That becomes especially relevant when a rigid-flex assembly eliminates detachable interconnects.
\n Once the system is integrated, access for rework may be less convenient than it was with several
\n independent rigid boards.\n <\/p>\n

\n Design for assembly should therefore consider how the finished geometry will be held, inspected,
\n tested and repaired, not just how it fits inside the enclosure.\n <\/p>\n<\/section>\n

\n

Surface Finish Still Follows the Assembly Requirement<\/h2>\n

\n Board flexibility does not determine surface finish by itself.\n <\/p>\n

\n The finish should instead match soldering, contact and packaging requirements. Common options across
\n PCB manufacturing<\/a> include hot air solder levelling (HASL), electroless nickel immersion gold (ENIG),
\n electroless nickel electroless palladium immersion gold (ENEPIG), immersion silver, immersion tin and
\n organic solderability preservative (OSP).\n <\/p>\n

\n The manufacturing consequence appears at the interface between the bare board and assembly process.\n <\/p>\n

\n A fine-pitch surface-mount pad benefits from predictable planarity. A connector contact may impose
\n different wear or mating requirements. A wire-bonding application creates another surface requirement.\n <\/p>\n

\n Choosing a board architecture first and blindly copying the finish from a previous project treats
\n two separate engineering decisions as though they were one.\n <\/p>\n<\/section>\n

\n

Choose the Architecture From the Mechanical Constraint Backward<\/h2>\n

\n Start with rigid unless the product gives you a specific reason not to.\n <\/p>\n

\n Choose a rigid PCB when the electronics fit on a stable planar structure and connectors or cables
\n do not create an unacceptable packaging, reliability or assembly problem.\n <\/p>\n

\n Choose flex when the circuit itself needs to pass through a constrained path, fold during installation
\n or accommodate controlled movement. Define bend regions and mechanical support before final routing.\n <\/p>\n

\n Choose rigid-flex when several rigid component regions need to occupy different planes and integrating
\n their interconnection provides enough system value to justify a more dependent stackup and manufacturing
\n sequence.\n <\/p>\n

\n The deciding calculation should be made at system level. A separate cable assembly has connectors,
\n mating operations, space claims and possible service advantages. Rigid-flex removes some of those
\n interfaces but combines more of the product into one manufactured structure.\n <\/p>\n

\n That trade should be made deliberately rather than reducing the decision to bare-board unit price.\n <\/p>\n<\/section>\n

\n

Send the Stackup With the Mechanical Intent<\/h2>\n

\n A manufacturer needs enough information to distinguish electrical connectivity from physical
\n construction. Fabrication data should therefore be accompanied by the intended stackup, drill
\n information, impedance requirements and fabrication notes where relevant. Assembly projects also
\n need the bill of materials, centroid data and assembly documentation.\n <\/p>\n

\n If you are preparing a rigid PCB or evaluating a more mechanically integrated architecture, RLX can
\n review the manufacturable portions of the design as part of an engineer-reviewed DFM<\/a> process. Send the
\n fabrication and assembly package with the mechanical requirements clearly identified so those
\n constraints are visible before production decisions are locked.\n <\/p>\n<\/section>\n

\n

FAQ<\/h2>\n

Is rigid-flex the same as connecting two rigid PCBs with a flex cable?<\/h3>\n

\n No. A cable or separate flex circuit creates discrete interconnect interfaces between independently
\n manufactured items. A rigid-flex PCB incorporates rigid and flexible regions into one circuit
\n construction. The finished products can serve a similar packaging purpose, but their stackup,
\n manufacturing sequence, assembly flow, repair strategy and connector count can be very different.\n <\/p>\n

Can components be mounted directly on a flex PCB?<\/h3>\n

\n Yes, but the mechanical behaviour around the component matters. Packages, connectors and solder joints
\n should not be placed where repeated bending transfers damaging strain into their terminations. Stiffened
\n component areas and controlled transition geometry are commonly used so the local assembly behaves
\n predictably while other regions remain flexible.\n <\/p>\n

Do flex circuits use the same routing rules as rigid PCBs?<\/h3>\n

\n Not completely. Electrical constraints still apply, but a flex circuit adds mechanical strain to the
\n routing problem. Trace direction through bends, width transitions, copper distribution, vias and nearby
\n stiffened regions can all affect fatigue behaviour. The bend geometry should therefore be defined before
\n routing is treated as finished.\n <\/p>\n

Are rigid-flex boards always better than connectors and cables?<\/h3>\n

\n No. Rigid-flex can reduce separate interconnects and help fit electronics into compact three-dimensional
\n spaces, but it also couples the mechanical design more tightly to the PCB stackup. Connectors and cable
\n assemblies can offer modularity, replacement access and easier separation of subassemblies. The better
\n architecture follows the product’s packaging, service and reliability requirements.\n <\/p>\n

What files should I send for a PCB manufacturing review?<\/h3>\n

\n For fabrication, useful manufacturing files include Gerber RS-274X, ODB++ or IPC-2581 data with NC
\n drill files, plus the stackup, impedance targets and fabrication notes where applicable. Assembly work
\n also requires the bill of materials, pick-and-place or centroid file and assembly drawing so fabrication
\n and component placement requirements can be reviewed together.\n <\/p>\n<\/section>\n","protected":false},"excerpt":{"rendered":"

Rigid, flex and rigid-flex PCBs solve different mechanical and electrical packaging problems. Rigid boards provide a fixed structure, flex circuits […]<\/p>\n","protected":false},"author":2,"featured_media":192,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"nf_dc_page":"","site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[18],"tags":[],"class_list":["post-116","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-manufacturing"],"_links":{"self":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/116","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/comments?post=116"}],"version-history":[{"count":4,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/116\/revisions"}],"predecessor-version":[{"id":193,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/116\/revisions\/193"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/media\/192"}],"wp:attachment":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/media?parent=116"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/categories?post=116"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/tags?post=116"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}