{"id":126,"date":"2026-07-19T09:00:00","date_gmt":"2026-07-19T09:00:00","guid":{"rendered":"https:\/\/rlxsolutions.com\/blog\/?p=126"},"modified":"2026-09-28T18:55:03","modified_gmt":"2026-09-28T18:55:03","slug":"pcb-requirements-for-medical-device-manufacturing","status":"publish","type":"post","link":"https:\/\/rlxsolutions.com\/blog\/pcb-requirements-for-medical-device-manufacturing\/","title":{"rendered":"Medical Electronics PCB Manufacturing Guide"},"content":{"rendered":"<p>\n        Medical electronics <a href=\"https:\/\/rlxsolutions.com\/pcb-manufacturing.html\">PCB manufacturing<\/a> requires more than placing components on a circuit board.<br \/>\n        Design decisions affect fabrication, soldering, inspection, test coverage, traceability and later<br \/>\n        production control. <a href=\"https:\/\/rlxsolutions.com\/\">RLX Solutions<\/a>, a contract electronics manufacturer in Concord, Ontario,<br \/>\n        reviews those interactions before a medical electronics build moves from files to finished assemblies.\n      <\/p>\n<p>\n        A medical programme also needs a clear distinction between the quality system surrounding the build<br \/>\n        and the workmanship requirements applied to the product. ISO 13485 addresses quality management for<br \/>\n        medical devices. IPC standards address areas such as PCB fabrication, soldering and assembly workmanship.<br \/>\n        They overlap operationally, but they are not substitutes for one another.\n      <\/p>\n<p>\n        For an OEM, that distinction matters because the manufacturing package must translate device requirements<br \/>\n        into measurable fabrication, assembly, inspection and test instructions. For other sectors, see our <a href=\"https:\/\/rlxsolutions.com\/blog\/pcb-industry-guides\/\">guide to PCB applications by industry<\/a>.\n      <\/p>\n<h2>Start With the Product Requirements, Not the PCB Quote<\/h2>\n<p>\n        A contract manufacturer can build only to the requirements communicated in the manufacturing package.<br \/>\n        For medical electronics, that package should resolve several questions before production:\n      <\/p>\n<ul>\n<li>What IPC workmanship class applies?<\/li>\n<li>Which assemblies, components and materials require lot or date-code traceability?<\/li>\n<li>Which electrical functions must be verified before shipment?<\/li>\n<li>Are hidden solder joints present under ball grid array (BGA), land grid array (LGA) or quad flat no-lead (QFN) packages?<\/li>\n<li>Does the board require conformal coating, underfill or encapsulation?<\/li>\n<li>Are moisture-sensitive devices involved?<\/li>\n<li>Are any obsolete, allocated or authenticity-sensitive components on the bill of materials (BOM)?<\/li>\n<li>Which characteristics require customer approval at first article?<\/li>\n<\/ul>\n<p>\n        These decisions change the production route.\n      <\/p>\n<p>\n        For example, specifying a BGA without defining suitable inspection leaves an important part of the<br \/>\n        solder joint inaccessible to ordinary visual inspection. Specifying a functional test without a test<br \/>\n        procedure, fixture interface or expected limits creates a similar gap at the end of the line.\n      <\/p>\n<p>\n        Design for manufacturability and design for assembly (DFM\/DFA) should therefore happen before release,<br \/>\n        rather than after a lot exposes an avoidable problem.\n      <\/p>\n<h2>Medical PCB Manufacturing Is a Chain of Controlled Processes<\/h2>\n<p>\n        The bare PCB is one part of the finished medical electronics assembly. Fabrication choices determine<br \/>\n        what the <a href=\"https:\/\/rlxsolutions.com\/pcb-assembly.html\">assembly process<\/a> receives, while assembly choices determine how thoroughly the finished product<br \/>\n        can be inspected and tested.\n      <\/p>\n<p>A typical flow contains these linked stages:<\/p>\n<ol>\n<li>\n          <strong>Engineering and DFM\/DFA review.<\/strong><br \/>\n          Stackup, footprints, clearances, package choices, assembly access and manufacturing files are reviewed before release.\n        <\/li>\n<li>\n          <strong>Bare PCB fabrication.<\/strong><br \/>\n          Lamination, drilling, plating, imaging, solder mask and surface finish create the printed circuit board.\n        <\/li>\n<li>\n          <strong>Component procurement and incoming inspection.<\/strong><br \/>\n          Parts are sourced, identified, inspected and controlled before placement.\n        <\/li>\n<li>\n          <strong>Solder paste inspection and placement.<\/strong><br \/>\n          Paste deposition is checked before components pass through reflow.\n        <\/li>\n<li>\n          <strong>Post-reflow inspection.<\/strong><br \/>\n          Automated optical inspection (AOI), manual inspection and X-ray are applied according to package geometry and workmanship requirements.\n        <\/li>\n<li>\n          <strong>Electrical and functional test.<\/strong><br \/>\n          Net connectivity, device programming and product functions are tested according to the build plan.\n        <\/li>\n<li>\n          <strong>First article approval and lot release.<\/strong><br \/>\n          The initial build establishes whether manufacturing output matches the approved documentation before the remaining production lot is released.\n        <\/li>\n<\/ol>\n<p>\n        A weakness at one stage can surface much later. Excess solder paste on a QFN thermal pad, for example,<br \/>\n        may become an X-ray finding after reflow. A footprint issue may first appear as repeated solder defects.<br \/>\n        An insufficient test strategy may allow an electrically assembled board to pass inspection even though<br \/>\n        a functional circuit is incorrect. Related reading: <a href=\"https:\/\/rlxsolutions.com\/blog\/consumer-electronics-pcb-manufacturing\/\">Consumer Electronics PCB Manufacturing Guide<\/a>.\n      <\/p>\n<h2>IPC Class 2 and Class 3 Change the Manufacturing Expectation<\/h2>\n<p>\n        IPC-A-610 defines electronic assembly acceptability criteria, while IPC-6012 addresses qualification<br \/>\n        and performance requirements for rigid printed boards. J-STD-001 addresses soldered electrical and<br \/>\n        electronic assemblies.\n      <\/p>\n<p>\n        Class 2 and Class 3 should not be treated as marketing labels. The selected class changes the workmanship<br \/>\n        and acceptance expectations applied to the product.\n      <\/p>\n<p>\n        Class 2 is associated with dedicated-service electronic products where continued performance is expected,<br \/>\n        but uninterrupted operation is not the defining requirement. Class 3 applies tighter acceptance expectations<br \/>\n        for high-performance or high-reliability electronics where continued performance can be especially important.\n      <\/p>\n<p>\n        For PCB fabrication, Class 3 also brings tighter expectations around features such as annular rings and plating.<br \/>\n        At assembly, the effect reaches solder joints, placement, inspection and documentation.\n      <\/p>\n<p>\n        The manufacturer needs the required class defined in the documentation. Leaving it to inference introduces<br \/>\n        ambiguity into inspection and acceptance.\n      <\/p>\n<h3>Do Not Confuse ISO 13485 With IPC Class 3<\/h3>\n<p>\n        ISO 13485 and IPC Class 3 answer different questions.\n      <\/p>\n<p>\n        ISO 13485 is a medical-device quality-management framework. IPC Class 3 is a product workmanship and performance<br \/>\n        classification. A programme can require quality-system controls while separately defining its PCB fabrication<br \/>\n        and assembly workmanship criteria.\n      <\/p>\n<p>\n        An ISO 13485-aligned manufacturing process therefore does not automatically make a circuit board Class 3,<br \/>\n        and a Class 3 build does not by itself establish ISO 13485 certification.\n      <\/p>\n<p>\n        That distinction should appear in supplier qualification documents, drawings, purchase requirements and<br \/>\n        quality agreements rather than being assumed from the word &#8220;medical.&#8221;\n      <\/p>\n<h2>PCB Stackup Decisions Affect Reliability Before Assembly Starts<\/h2>\n<p>\n        Medical electronics do not automatically require a high layer count or high-density interconnect (HDI).<br \/>\n        The stackup should follow electrical, mechanical and routing requirements.\n      <\/p>\n<p>\n        A four-layer control board with ordinary through vias may be easier to fabricate and inspect than an<br \/>\n        eight-layer board using blind vias and via-in-pad structures. The second board can still be the correct design,<br \/>\n        but it creates additional process dependencies.\n      <\/p>\n<p>\n        Blind vias on a multilayer board require sequential lamination because the via must connect selected layers<br \/>\n        rather than pass through the complete finished stack. Via-in-pad plated over structures add resin filling,<br \/>\n        copper capping and planarization. Laser-drilled microvias introduce another drilling and plating route.\n      <\/p>\n<p>Those decisions should be intentional.<\/p>\n<h3>Worked Example: Two 10-Layer Medical Boards<\/h3>\n<p>\n        Consider two hypothetical 10-layer PCB designs with the same outline and 1.6 mm finished thickness.\n      <\/p>\n<table>\n<thead>\n<tr>\n<th>Decision Factor<\/th>\n<th>Board A<\/th>\n<th>Board B<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Layer count<\/td>\n<td>10 layers<\/td>\n<td>10 layers<\/td>\n<\/tr>\n<tr>\n<td>Via structure<\/td>\n<td>Through vias<\/td>\n<td>Layer 1 to 2 microvias, Layer 2 to 3 microvias, buried Layer 3 to Layer 8 vias<\/td>\n<\/tr>\n<tr>\n<td>BGA escape<\/td>\n<td>Conventional dog-bone routing<\/td>\n<td>Via-in-pad under dense BGA<\/td>\n<\/tr>\n<tr>\n<td>Lamination<\/td>\n<td>Conventional multilayer sequence<\/td>\n<td>Sequential lamination required<\/td>\n<\/tr>\n<tr>\n<td>Via processing<\/td>\n<td>Mechanical drilling and plating<\/td>\n<td>Laser drilling, internal via processing, filling and capping<\/td>\n<\/tr>\n<tr>\n<td>Manufacturing consequence<\/td>\n<td>Fewer dependent process stages<\/td>\n<td>More drilling, plating, lamination and planarization stages<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>\n        The two boards have identical layer counts, yet they should not be expected to carry the same manufacturing<br \/>\n        cost or process risk.\n      <\/p>\n<p>\n        Board B needs additional fabrication stages because its interconnect architecture is built in separate layer groups.<br \/>\n        A defect introduced early in the sequence can affect material that has already undergone several processing steps.<br \/>\n        Board A avoids those stages because the through holes are drilled after the multilayer structure is formed.\n      <\/p>\n<p>\n        Layer count is therefore a poor purchasing proxy when used alone.\n      <\/p>\n<h2>Aspect Ratio Becomes Important on Small Holes and Thick Boards<\/h2>\n<p>\n        A plated-through-hole aspect ratio is the relationship between PCB thickness and drilled hole diameter.<br \/>\n        As the board becomes thicker or the hole becomes smaller, depositing plating uniformly through the barrel<br \/>\n        becomes more demanding.\n      <\/p>\n<p>\n        Consider a hypothetical 2.0 mm thick board with a 0.20 mm plated hole. Its nominal thickness-to-hole relationship<br \/>\n        is 10:1.\n      <\/p>\n<p>\n        Change only the hole diameter to 0.15 mm and the relationship increases to roughly 13.3:1.<br \/>\n        The PCB still looks similar in CAD, but the plating problem has changed substantially.\n      <\/p>\n<p>\n        This is why via diameter, finished thickness and plating expectations must be evaluated together.<br \/>\n        Reducing a via because routing is congested is not an isolated layout decision.\n      <\/p>\n<p>\n        If the design is approaching a fabrication boundary, alternatives may include increasing the drilled diameter,<br \/>\n        reducing finished board thickness, changing the via architecture or revisiting routing density.\n      <\/p>\n<h2>Surface Finish Connects Fabrication to Solderability<\/h2>\n<p>\n        Surface finish protects exposed copper and creates the interface that assembly will solder to.\n      <\/p>\n<p>\n        Common options include hot air solder levelling (HASL), electroless nickel immersion gold (ENIG),<br \/>\n        electroless nickel electroless palladium immersion gold (ENEPIG), immersion silver, immersion tin and<br \/>\n        organic solderability preservative (OSP).\n      <\/p>\n<p>\n        The selection should reflect the assembly and product requirements rather than appearance.\n      <\/p>\n<p>\n        Fine-pitch surface-mount pads generally benefit from a flat finish because component coplanarity and paste<br \/>\n        deposition are sensitive to pad geometry. Wire bonding changes the finish requirement again. OSP can make<br \/>\n        sense for suitable single-reflow builds, but the expected assembly sequence and handling should be considered<br \/>\n        before it is specified.\n      <\/p>\n<p>\n        The engineering question is therefore not &#8220;Which finish is best?&#8221; It is &#8220;Which finish supports the component<br \/>\n        terminations, assembly sequence, storage plan and downstream processes on this board?&#8221;\n      <\/p>\n<h2>Inspection Must Match the Failure Mode<\/h2>\n<p>No single inspection technology sees every defect.<\/p>\n<p>\n        Solder paste inspection (SPI) measures paste before reflow, including parameters such as volume, area and offset.<br \/>\n        Catching a stencil-printing problem at this point prevents defective deposits from travelling further through assembly.\n      <\/p>\n<p>\n        AOI examines visible features after reflow. It is useful for component presence, orientation, placement and visible<br \/>\n        solder conditions.\n      <\/p>\n<p>\n        X-ray inspection addresses a different visibility problem. Solder joints beneath BGAs, LGAs and QFNs cannot be<br \/>\n        fully evaluated from the surface, so X-ray can examine hidden interconnects and conditions such as voiding.\n      <\/p>\n<p>\n        Manual visual inspection under magnification remains relevant because acceptance still requires judgement against<br \/>\n        the applicable workmanship criteria.\n      <\/p>\n<h3>Worked Example: 0.5 mm Pitch BGA Versus Visible Gull-Wing Leads<\/h3>\n<p>\n        Take a hypothetical six-layer diagnostic interface board containing two packages:\n      <\/p>\n<ul>\n<li>a 0.5 mm pitch BGA with 196 balls;<\/li>\n<li>a gull-wing connector interface with visible soldered leads.<\/li>\n<\/ul>\n<p>\n        Both devices pass through the same reflow process, but their inspection paths differ.\n      <\/p>\n<p>\n        AOI can inspect visible features around the BGA package, but the solder balls are underneath the body.<br \/>\n        X-ray is therefore the process that gives access to the hidden joint pattern. The gull-wing leads, by comparison,<br \/>\n        expose their solder fillets to optical and manual inspection.\n      <\/p>\n<p>\n        The package architecture determines the useful inspection method. Calling for &#8220;100% inspection&#8221; without naming<br \/>\n        the method can still leave the most relevant defect mechanism unseen.\n      <\/p>\n<h2>Testing Answers Questions That Inspection Cannot<\/h2>\n<p>\n        Inspection determines whether manufacturing features appear acceptable. Electrical test determines whether<br \/>\n        connections and functions behave as intended.\n      <\/p>\n<p>\n        Flying-probe in-circuit test (ICT) can be useful for prototypes and lower volumes because it does not require<br \/>\n        a dedicated bed-of-nails fixture. Production programmes may justify fixture-based ICT where repeated access<br \/>\n        to test nodes is available.\n      <\/p>\n<p>\n        Functional test (FCT) addresses a different level of verification. It exercises the finished electronics against<br \/>\n        a customer-defined procedure and can record pass\/fail results against serialised assemblies.\n      <\/p>\n<p>Those methods should be planned during design.<\/p>\n<p>\n        If an engineer routes every useful test node under inaccessible components, ICT coverage becomes harder.<br \/>\n        If the functional-test procedure requires a programming header that was removed to save board area,<br \/>\n        the manufacturing problem was created in layout.\n      <\/p>\n<p>Design for test is therefore part of design for manufacturing.<\/p>\n<h2>Traceability Begins With Components, Not the Final Label<\/h2>\n<p>\n        Medical electronics programmes often need records that connect finished assemblies to the material and<br \/>\n        processes used to build them.\n      <\/p>\n<p>\n        Useful traceability can include component lot codes, date codes, process documentation, serialisation and test records.<br \/>\n        The value is relational. A serial number on the finished enclosure adds little if it cannot be linked back to the<br \/>\n        production records needed for investigation.\n      <\/p>\n<p>\n        Moisture-sensitive device control is another part of that chain. IPC\/JEDEC J-STD-033 governs handling practices<br \/>\n        for moisture-sensitive devices. Dry storage and appropriate handling help control the risk of moisture-related<br \/>\n        package damage during soldering.\n      <\/p>\n<p>\n        Electrostatic discharge (ESD) control similarly protects sensitive components before failures become visible<br \/>\n        at end-of-line test.\n      <\/p>\n<p>These controls matter because latent damage may not present as an obvious assembly defect.<\/p>\n<h2>Component Procurement Is Part of Medical Electronics Risk Control<\/h2>\n<p>\n        A technically correct PCB design can still inherit risk through the supply chain.\n      <\/p>\n<p>\n        Authorized distribution gives a strong procurement path, but medical programmes can remain in production long enough<br \/>\n        for parts to become allocated, obsolete or end-of-life. That is where sourcing discipline and authenticity verification<br \/>\n        become relevant.\n      <\/p>\n<p>A counterfeit-prevention workflow can include:<\/p>\n<ul>\n<li>source vetting;<\/li>\n<li>packaging and moisture-bag inspection;<\/li>\n<li>date-code and country-of-origin verification;<\/li>\n<li>visual inspection using IDEA-STD-1010 criteria;<\/li>\n<li>lot verification against manufacturer production records;<\/li>\n<li>X-ray examination of die and bond-wire construction;<\/li>\n<li>sample electrical, curve-trace or parametric testing;<\/li>\n<li>escalation to decapsulation and die analysis when required.<\/li>\n<\/ul>\n<p>\n        The mechanism is important. A package can carry convincing external markings while containing an incorrect die,<br \/>\n        recycled material or a part outside the required electrical characteristics. Visual inspection alone cannot resolve<br \/>\n        every authenticity question.\n      <\/p>\n<p>\n        For long-life medical products, approved-alternative planning and lifecycle monitoring should therefore begin before<br \/>\n        a component disappears from normal distribution.\n      <\/p>\n<h2>Protective Coatings and Encapsulation Need Design Input<\/h2>\n<p>Conformal coating, underfill and potting solve different problems.<\/p>\n<p>\n        Conformal coating applies a protective polymer layer over the assembled circuit board. Acrylic, silicone,<br \/>\n        polyurethane and parylene processes can be applied selectively or across larger board areas depending on<br \/>\n        the programme requirements.\n      <\/p>\n<p>\n        Underfill places material beneath components to alter mechanical support and stress behaviour. It is commonly<br \/>\n        associated with packages where the solder interconnect sits beneath the component.\n      <\/p>\n<p>\n        Potting or encapsulation surrounds larger areas of an assembly in protective material.\n      <\/p>\n<p>\n        These processes affect manufacturing access. Connectors, test points, programming pads, switches, pressure interfaces<br \/>\n        or other keep-out features may need masking or exclusion. If coating requirements arrive after layout release,<br \/>\n        the manufacturer may be forced to solve access and masking problems that could have been designed out earlier.\n      <\/p>\n<h2>First Article Approval Separates Process Setup From Production Release<\/h2>\n<p>\n        A first article inspection (FAI) gives the OEM an opportunity to assess a new build before the production lot proceeds.\n      <\/p>\n<p>\n        The important point is not merely that one assembly is inspected. The first article is where the released fabrication<br \/>\n        package, BOM, placement data, assembly drawing, workmanship requirements, programming instructions and test plan meet<br \/>\n        the actual manufacturing process.\n      <\/p>\n<p>\n        If the first article reveals a footprint polarity error, inaccessible test node or documentation conflict,<br \/>\n        the issue can be resolved before the same problem is repeated across the lot.\n      <\/p>\n<p>\n        For a new medical electronics build, customer approval of the first article should therefore be treated as a production<br \/>\n        gate, not an administrative formality.\n      <\/p>\n<h2>Give the Manufacturer a Complete Release Package<\/h2>\n<p>\n        A complete release package reduces interpretation during quoting and production.\n      <\/p>\n<p>For the bare PCB, manufacturing data can include:<\/p>\n<ul>\n<li>Gerber RS-274X, ODB++ or IPC-2581 data;<\/li>\n<li>NC drill files;<\/li>\n<li>stackup information;<\/li>\n<li>impedance targets;<\/li>\n<li>fabrication notes.<\/li>\n<\/ul>\n<p>For assembly, add:<\/p>\n<ul>\n<li>BOM in spreadsheet or CSV form;<\/li>\n<li>pick-and-place or centroid data;<\/li>\n<li>assembly drawing;<\/li>\n<li>applicable workmanship class;<\/li>\n<li>programming requirements;<\/li>\n<li>test procedure and acceptance criteria;<\/li>\n<li>serialisation requirements;<\/li>\n<li>coating or encapsulation instructions where applicable.<\/li>\n<\/ul>\n<p>\n        Native design files can also support engineering review when design work or deeper troubleshooting is required.\n      <\/p>\n<p>\n        File completeness affects more than administrative speed. An omitted polarity indication can become an assembly ambiguity.<br \/>\n        Missing impedance information can affect fabrication engineering. A BOM without manufacturer part numbers can create<br \/>\n        procurement interpretation that should have been resolved by the designer.\n      <\/p>\n<h2>Build the Quality Plan Around the Actual Medical Product<\/h2>\n<p>\n        A small monitoring accessory, a laboratory instrument controller and electronics intended for a high-reliability<br \/>\n        medical function do not create identical manufacturing risks.\n      <\/p>\n<p>\n        The quality plan should follow the actual product requirements: applicable workmanship class, component risk,<br \/>\n        hidden-joint inspection, traceability depth, electrical test, functional verification and protective processing.\n      <\/p>\n<p>\n        A useful manufacturing review connects each requirement to a process that can produce objective evidence.\n      <\/p>\n<p>\n        For example, a requirement for hidden BGA joint inspection points toward X-ray. A requirement for serial-level<br \/>\n        functional history points toward logged FCT and serialisation. A requirement for controlled bare-board impedance<br \/>\n        points toward coupon verification by time-domain reflectometry (TDR).\n      <\/p>\n<p>\n        The specification becomes meaningful when each requirement has a manufacturing mechanism behind it.\n      <\/p>\n<h2>Prepare the Build for Engineering Review<\/h2>\n<p>\n        If you are preparing a medical electronics board for prototype, pilot or production release, RLX can review the<br \/>\n        design and manufacturing package as part of the quoting process. Send the Gerbers or other manufacturing data,<br \/>\n        BOM, pick-and-place file, drawings, stackup requirements and test information so the PCB, assembly, sourcing and<br \/>\n        verification requirements can be assessed together.\n      <\/p>\n<section id=\"faq\">\n<h2>Frequently Asked Questions<\/h2>\n<h3>Does a medical PCB have to be IPC Class 3?<\/h3>\n<p>\n          Not automatically. The required workmanship class comes from the product and programme requirements.<br \/>\n          IPC Class 2 and Class 3 impose different acceptance expectations, with Class 3 applying tighter criteria.<br \/>\n          The OEM should define the required class in the fabrication and assembly documentation rather than expecting<br \/>\n          the manufacturer to infer it from the product being medical.\n        <\/p>\n<h3>Is RLX ISO 13485 certified?<\/h3>\n<p>\n          RLX operates ISO 13485-aligned processes for medical programmes. ISO 13485 alignment should not be described<br \/>\n          as ISO 13485 certification. The company holds ISO 9001:2015 certification, while medical manufacturing requirements<br \/>\n          can incorporate ISO 13485-aligned controls alongside the applicable PCB fabrication, assembly, inspection and<br \/>\n          traceability requirements.\n        <\/p>\n<h3>What inspection is used for BGAs on medical electronics?<\/h3>\n<p>\n          BGA solder joints are hidden beneath the package, so surface inspection cannot fully evaluate them.<br \/>\n          X-ray inspection can examine BGA, LGA and QFN joints and support void analysis. That inspection can be combined<br \/>\n          with solder paste inspection before reflow, automated optical inspection after reflow and manual IPC-A-610<br \/>\n          visual inspection as applicable to the assembly.\n        <\/p>\n<h3>Can medical PCB assemblies be functionally tested?<\/h3>\n<p>\n          Yes. Functional test can be performed to a customer-defined specification, with pass\/fail logging tied to serial<br \/>\n          traceability. The OEM needs to provide the expected test procedure and acceptance criteria. Test access should<br \/>\n          be considered during layout because connector access, programming interfaces and test-point placement can determine<br \/>\n          how efficiently the finished assembly can be verified.\n        <\/p>\n<h3>What files are needed to quote a medical electronics PCB assembly?<\/h3>\n<p>\n          A useful assembly package includes the bare-board manufacturing data, NC drill data, BOM, pick-and-place or centroid<br \/>\n          file, assembly drawing and relevant fabrication notes. Stackup and impedance requirements should also be included<br \/>\n          where applicable. Programming, functional-test, serialisation, coating and workmanship requirements should be supplied<br \/>\n          when they form part of the production scope.\n        <\/p>\n<h3>How should obsolete medical electronics components be sourced?<\/h3>\n<p>\n          The sourcing route should preserve authenticity and traceability while addressing availability. Authorized distribution<br \/>\n          is one channel, while constrained or obsolete parts may require vetted independent sources. Higher-risk material can<br \/>\n          undergo packaging inspection, IDEA-STD-1010 visual inspection, lot verification, X-ray and electrical testing, with<br \/>\n          further analysis used when authenticity cannot otherwise be established.\n        <\/p>\n<\/section>\n","protected":false},"excerpt":{"rendered":"<p>Medical electronics PCB manufacturing requires more than placing components on a circuit board. Design decisions affect fabrication, soldering, inspection, test [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":213,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"nf_dc_page":"","site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[20],"tags":[],"class_list":["post-126","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-guides"],"_links":{"self":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/126","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/comments?post=126"}],"version-history":[{"count":4,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/126\/revisions"}],"predecessor-version":[{"id":214,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/126\/revisions\/214"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/media\/213"}],"wp:attachment":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/media?parent=126"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/categories?post=126"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/tags?post=126"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}