{"id":176,"date":"2026-07-05T09:00:00","date_gmt":"2026-07-05T09:00:00","guid":{"rendered":"https:\/\/rlxsolutions.com\/blog\/quick-turn-pcb-assembly\/"},"modified":"2026-07-05T09:00:00","modified_gmt":"2026-07-05T09:00:00","slug":"quick-turn-pcb-assembly","status":"publish","type":"post","link":"https:\/\/rlxsolutions.com\/blog\/quick-turn-pcb-assembly\/","title":{"rendered":"Quick-Turn PCB Assembly: Lead Times, Files &#038; Production Planning"},"content":{"rendered":"<p>\n      Quick-turn <a href=\"https:\/\/rlxsolutions.com\/blog\/pcb-assembly-guide\/\">PCB assembly<\/a> succeeds when the build is ready to manufacture before the clock starts:<br \/>\n      complete fabrication data, a clean BOM, accurate centroid data, assembly drawings, confirmed component<br \/>\n      availability, and a defined inspection and test plan. <a href=\"https:\/\/rlxsolutions.com\/\">RLX Solutions<\/a>, a contract electronics manufacturer<br \/>\n      in Concord, Ontario, reviews those inputs before quoting so schedule risk is visible early.\n    <\/p>\n<h2>Quick-turn lead time starts before assembly<\/h2>\n<p>\n      A fast assembly schedule is not simply a faster placement machine setting. Lead time is the sum of several<br \/>\n      dependent activities: bare board availability, component procurement, incoming inspection, stencil and<br \/>\n      process preparation, placement, reflow, inspection, test, first article approval, and production release.\n    <\/p>\n<p>\n      That distinction matters because an assembler can have open production capacity while the job itself is<br \/>\n      not ready to enter production.\n    <\/p>\n<p>\n      For a turnkey build, component procurement and bare PCB availability become part of the schedule. For a<br \/>\n      kitted build, the customer supplies selected critical or long-lead parts while the manufacturer sources<br \/>\n      the remainder. With a consigned build, the customer supplies the complete kit. Each approach moves the<br \/>\n      schedule risk to a different point.\n    <\/p>\n<p>\n      A missing resistor may be easy to resolve. A missing processor, connector, allocated IC, or approved<br \/>\n      substitute can hold the entire <a href=\"https:\/\/rlxsolutions.com\/pcb-assembly.html\">printed circuit board assembly<\/a> even though 99% of the bill of materials<br \/>\n      is available.\n    <\/p>\n<p>\n      The same applies to bare boards. Fabrication timing and assembly timing should not be treated as one number.<br \/>\n      For reference, bare PCB fabrication has separate production windows:\n    <\/p>\n<table>\n<thead>\n<tr>\n<th>Bare-board stage<\/th>\n<th>Fabrication timing<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Prototype<\/td>\n<td>5-day standard, 3-day expedite<\/td>\n<\/tr>\n<tr>\n<td>Pilot, 25 to 500 PCBs<\/td>\n<td>2 to 3 weeks typical<\/td>\n<\/tr>\n<tr>\n<td>Production, 500 to 50,000+ PCBs<\/td>\n<td>3 to 6 weeks typical<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>\n      Those are fabrication windows, not a promised assembly turnaround. The assembly schedule still depends<br \/>\n      on the BOM, supplied files, inspection requirements, test content and production release conditions.\n    <\/p>\n<p>\n      This is why &#8220;How fast can you build it?&#8221; is best answered after the manufacturing package and sourcing<br \/>\n      plan have been reviewed.\n    <\/p>\n<h2>Start the clock with a complete manufacturing package<\/h2>\n<p>\n      A quick-turn build should arrive as a production package, not as a collection of files that still requires<br \/>\n      interpretation.\n    <\/p>\n<p>For PCB assembly, the core data set is:<\/p>\n<ul>\n<li>\n        <strong>Bare-board manufacturing data:<\/strong><br \/>\n        Gerber RS-274X, ODB++, IPC-2581 and NC drill data are accepted manufacturing formats.\n      <\/li>\n<li>\n        <strong>Bill of materials:<\/strong><br \/>\n        BOM in <code>.xlsx<\/code> or <code>.csv<\/code>, with unambiguous manufacturer part information and quantities.\n      <\/li>\n<li>\n        <strong>Pick-and-place data:<\/strong><br \/>\n        centroid information that identifies component coordinates, rotations and board side.\n      <\/li>\n<li>\n        <strong>Assembly drawing:<\/strong><br \/>\n        a visual reference for fitted and omitted positions, polarity, orientation and mechanical details.\n      <\/li>\n<li>\n        <strong>Fabrication documentation:<\/strong><br \/>\n        stackup PDF, impedance targets and fabrication notes when they are relevant to the board.\n      <\/li>\n<li>\n        <strong>Test requirements:<\/strong><br \/>\n        the intended in-circuit or functional test method, fixtures or customer procedures where applicable.\n      <\/li>\n<li>\n        <strong>Programming information:<\/strong><br \/>\n        firmware and instructions when in-system programming, JTAG\/SWD, bootloader loading or related programming<br \/>\n        is required.\n      <\/li>\n<\/ul>\n<p>\n      Each file closes a different production question.\n    <\/p>\n<p>\n      The BOM tells procurement what must be purchased. The centroid file tells placement equipment where a part<br \/>\n      belongs. The assembly drawing gives the production and inspection teams a human-readable reference. Gerbers<br \/>\n      or another accepted manufacturing data set define the physical circuit board. Test instructions define what<br \/>\n      &#8220;pass&#8221; means after soldering.\n    <\/p>\n<p>\n      If those sources disagree, production should stop and resolve the discrepancy rather than guess.\n    <\/p>\n<p>\n      Consider a hypothetical 6-layer board with 320 placements. The BOM calls U14 a 3.3 V regulator, the centroid<br \/>\n      file places U14 at X52.40\/Y31.85, and the assembly drawing marks that position as do-not-fit. That is not a<br \/>\n      placement-machine problem. It is a release-data conflict. Finding it during engineering review protects far<br \/>\n      more schedule than discovering it after the stencil has been printed and material issued.\n    <\/p>\n<p>\n      An engineer-reviewed design for manufacturability and design for assembly review, or DFM\/DFA review, therefore<br \/>\n      has a direct scheduling function. It exposes unclear data before production resources are committed.\n    <\/p>\n<h2>BOM readiness can decide whether a &#8220;quick-turn&#8221; build is quick<\/h2>\n<p>\n      Component availability often controls the real start date.\n    <\/p>\n<p>\n      A production-ready BOM needs more than reference designators and values. Procurement must be able to identify<br \/>\n      exactly what can be purchased, whether approved alternates exist, and which parts are customer-controlled.\n    <\/p>\n<p>\n      That becomes especially important for obsolete, end-of-life, allocated or long-lead components. Sourcing<br \/>\n      outside <a href=\"https:\/\/rlxsolutions.com\/component-procurement.html\">authorized distribution<\/a> may also require additional authenticity controls.\n    <\/p>\n<p>\n      Four sourcing paths can be used depending on the programme: authorized distribution, vetted excess inventory<br \/>\n      networks, global sourcing networks, and customer inventory. The sourcing decision affects both timing and the<br \/>\n      inspection work required before parts reach the line.\n    <\/p>\n<p>\n      For higher-risk supply, verification can include packaging inspection, date-code and country-of-origin checks,<br \/>\n      visual inspection to IDEA-STD-1010 criteria, lot verification, X-ray, electrical testing and escalation to<br \/>\n      third-party decapsulation and die analysis where required.\n    <\/p>\n<p>\n      That work cannot be compressed into a purchase-order timestamp. If authenticity cannot be established, the<br \/>\n      part should not proceed into the build.\n    <\/p>\n<h3>Worked example: one unavailable part stops 1,200 placements<\/h3>\n<p>\n      Suppose a hypothetical control board has 1,200 component placements and 185 unique BOM lines. Every item is<br \/>\n      ready except a single microcontroller used at U1.\n    <\/p>\n<p>\n      The line could have reels for the other 1,199 placements, but that does not make the board production-ready.<br \/>\n      Placing the available parts first may create additional handling, work-in-process controls and a second<br \/>\n      assembly operation later.\n    <\/p>\n<p>\n      The cleaner planning choice is often to resolve U1 before releasing the lot. That can mean locating traceable<br \/>\n      stock, approving a valid alternate through the customer&#8217;s engineering process, or moving a customer-held part<br \/>\n      into a kitted build.\n    <\/p>\n<p>\n      The scheduling lesson is simple: BOM completion is measured by production readiness, not by the percentage<br \/>\n      of line items purchased.\n    <\/p>\n<h2>Plan the first article as a production gate<\/h2>\n<p>\n      First article inspection (FAI) is part of production planning, not an administrative step after assembly.\n    <\/p>\n<p>\n      Every new build should establish that the manufacturing interpretation matches the released design before the<br \/>\n      full lot is released. The first article provides a controlled point to verify assembly, workmanship, inspection<br \/>\n      results and required test outputs.\n    <\/p>\n<p>\n      Customer sign-off before production lot release creates a deliberate gate. That gate prevents the full quantity<br \/>\n      from being built around an incorrect orientation, drawing interpretation, substitution, programming revision<br \/>\n      or test assumption.\n    <\/p>\n<p>The schedule should therefore include three distinct states:<\/p>\n<ol>\n<li>\n        <strong>Build-ready:<\/strong><br \/>\n        files, material and production instructions are complete.\n      <\/li>\n<li>\n        <strong>First article complete:<\/strong><br \/>\n        the first board has passed the defined manufacturing and inspection process.\n      <\/li>\n<li>\n        <strong>Production released:<\/strong><br \/>\n        customer approval has been received and the remaining lot can proceed.\n      <\/li>\n<\/ol>\n<p>\n      Collapsing those states into one date creates avoidable risk.\n    <\/p>\n<p>\n      For example, imagine a 100-board pilot lot using a polarized connector whose mechanical key is shown clearly<br \/>\n      on the drawing but whose footprint orientation has changed from an earlier revision. Building all 100 boards<br \/>\n      before approval multiplies the consequence of one release error. Building the first article, verifying it<br \/>\n      and then releasing the remaining 99 contains the problem at one unit.\n    <\/p>\n<p>\n      That is why the fastest production plan is not always the plan with the fewest gates. A well-placed gate can<br \/>\n      protect the rest of the schedule.\n    <\/p>\n<h2>Board A vs Board B: the same layer count can produce different assembly schedules<\/h2>\n<p>\n      Layer count does not determine assembly effort by itself. Package geometry, board side count, inspection<br \/>\n      method, soldering process and test requirements can make two otherwise similar boards very different<br \/>\n      production jobs.\n    <\/p>\n<p>\n      Consider two hypothetical 8-layer, 1.6 mm circuit boards ordered in the same quantity.\n    <\/p>\n<table>\n<thead>\n<tr>\n<th>Decision factor<\/th>\n<th>Board A<\/th>\n<th>Board B<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Layer count<\/td>\n<td>8 layers<\/td>\n<td>8 layers<\/td>\n<\/tr>\n<tr>\n<td>Assembly sides<\/td>\n<td>Top side only<\/td>\n<td>Both sides<\/td>\n<\/tr>\n<tr>\n<td>Smallest passive<\/td>\n<td>0402<\/td>\n<td>0201<\/td>\n<\/tr>\n<tr>\n<td>Fine-pitch package<\/td>\n<td>0.8 mm BGA<\/td>\n<td>0.4 mm BGA<\/td>\n<\/tr>\n<tr>\n<td>Bottom-terminated package<\/td>\n<td>None<\/td>\n<td>QFN with thermal pad<\/td>\n<\/tr>\n<tr>\n<td>Inspection path<\/td>\n<td>SPI, AOI, visual<\/td>\n<td>SPI, AOI, AXI, visual<\/td>\n<\/tr>\n<tr>\n<td>Reflow sequence<\/td>\n<td>Single-sided sequence<\/td>\n<td>Double-sided sequence<\/td>\n<\/tr>\n<tr>\n<td>Test<\/td>\n<td>Basic functional test<\/td>\n<td>Functional test plus programmed serial data<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>\n      Board A can move through a simpler physical sequence. Board B needs more assembly operations and additional<br \/>\n      inspection coverage even though the bare PCB layer count is identical.\n    <\/p>\n<p>\n      The mechanism matters. Fine-pitch BGA solder joints are hidden after reflow, so automated optical inspection<br \/>\n      cannot assess the joints directly. Automated X-ray inspection, or AXI, is used for packages such as BGAs,<br \/>\n      LGAs and QFNs, including void analysis where applicable.\n    <\/p>\n<p>\n      A double-sided board also adds another assembly sequence. That affects paste printing, placement, reflow<br \/>\n      planning and handling. Programming or serialized data adds another controlled operation after assembly.\n    <\/p>\n<p>\n      Board B therefore carries more assembly work and more scheduling dependencies. A quote engine that considers<br \/>\n      only board size, layer count and component quantity can miss the operations that actually differentiate the<br \/>\n      two builds.\n    <\/p>\n<h2>Put inspection and test into the production route before quoting<\/h2>\n<p>\n      Inspection is part of the manufacturing sequence, so its requirements should be known when the build is planned.\n    <\/p>\n<p>\n      For <a href=\"https:\/\/rlxsolutions.com\/blog\/smt-assembly-process\/\">surface-mount assembly<\/a>, solder paste inspection (SPI) takes place before reflow and checks paste volume,<br \/>\n      area and offset. Automated optical inspection (AOI) follows reflow on both sides. AXI is used where solder<br \/>\n      joints or thermal pads cannot be fully evaluated optically. Manual visual inspection then applies the required<br \/>\n      IPC-A-610 Class 2 or Class 3 workmanship criteria under magnification.\n    <\/p>\n<p>\n      Test creates another branch in the production route.\n    <\/p>\n<p>\n      Flying-probe in-circuit test suits prototype and low-volume work because it does not require a dedicated fixture<br \/>\n      and can provide full net coverage. Bed-of-nails in-circuit test is a production option where the required<br \/>\n      fixture is customer-supplied or developed for the programme. Functional test runs to the customer&#8217;s specification<br \/>\n      and can record pass\/fail results with serial traceability.\n    <\/p>\n<p>\n      These choices must be made before the schedule is treated as firm.\n    <\/p>\n<p>\n      A hypothetical 25-board engineering build, for example, may use flying probe because committing to a dedicated<br \/>\n      production fixture at that stage is unnecessary. The same design at a later production volume may move to a<br \/>\n      bed-of-nails strategy. The circuit has not changed, but the test route has.\n    <\/p>\n<p>\n      Test access should also be considered during design. Discovering after assembly that a required net has no<br \/>\n      practical test access turns a production problem back into a design problem.\n    <\/p>\n<h2>Material handling continues after procurement<\/h2>\n<p>\n      Quick-turn planning should account for what happens to components after they arrive.\n    <\/p>\n<p>\n      Electrostatic discharge (ESD) control and moisture-sensitive device (MSD) handling protect parts between<br \/>\n      receiving and placement. ESD work zones can be aligned with ANSI\/ESD S20.20, while moisture-sensitive devices<br \/>\n      are handled under IPC\/JEDEC J-STD-033 practices including dry-cabinet storage.\n    <\/p>\n<p>\n      This matters because component condition affects soldering reliability.\n    <\/p>\n<p>\n      A moisture-sensitive package that has exceeded its allowable exposure condition cannot simply be treated as<br \/>\n      another reel waiting at the feeder. Similarly, questionable packaging integrity or mismatched date-code<br \/>\n      information can trigger incoming inspection before the lot is released.\n    <\/p>\n<p>\n      For a quick-turn job, incoming material status should therefore be visible in the same planning conversation<br \/>\n      as line capacity. A component that is physically in the building is not necessarily production-ready.\n    <\/p>\n<h2>Treat special processes as separate scheduling operations<\/h2>\n<p>\n      Programming, coating, underfill, potting, selective soldering, press-fit insertion and BGA rework all add<br \/>\n      process steps outside ordinary SMT placement and reflow.\n    <\/p>\n<p>\n      The manufacturing route should identify these operations before the build begins.\n    <\/p>\n<p>\n      Take a hypothetical mixed-technology board with 180 SMT placements, six through-hole connectors and firmware<br \/>\n      loaded through SWD. If planning stops at SMT reflow, the quoted sequence is incomplete. The board still requires<br \/>\n      the through-hole operation, programming, inspection and whatever functional test proves the programmed unit<br \/>\n      behaves as expected.\n    <\/p>\n<p>\n      The same reasoning applies to conformal coating. Acrylic, silicone, polyurethane, parylene, selective coating<br \/>\n      and full-board coating are different manufacturing instructions. Masking, cure requirements and inspection<br \/>\n      need to be part of the production definition rather than added after assembly is complete.\n    <\/p>\n<p>\n      A fast build depends on knowing the complete route before material is launched.\n    <\/p>\n<h2>Production planning should follow the dependency chain<\/h2>\n<p>\n      A practical quick-turn plan can be built around dependencies rather than a requested ship date.\n    <\/p>\n<ol>\n<li>\n        <strong>Freeze the released design data.<\/strong><br \/>\n        Make sure fabrication, BOM, centroid and drawing revisions belong together.\n      <\/li>\n<li>\n        <strong>Confirm sourcing status.<\/strong><br \/>\n        Identify customer-supplied, allocated, long-lead or authenticity-sensitive parts.\n      <\/li>\n<li>\n        <strong>Confirm bare-board timing.<\/strong><br \/>\n        Keep fabrication lead time separate from assembly timing.\n      <\/li>\n<li>\n        <strong>Define process requirements.<\/strong><br \/>\n        Include SMT, through-hole, selective solder, programming and special processes.\n      <\/li>\n<li>\n        <strong>Define inspection.<\/strong><br \/>\n        Specify Class 2 or Class 3 workmanship and identify packages that require X-ray.\n      <\/li>\n<li>\n        <strong>Define electrical and functional test.<\/strong><br \/>\n        Supply the test method, fixture information and pass\/fail criteria where needed.\n      <\/li>\n<li>\n        <strong>Build and approve the first article.<\/strong><br \/>\n        Treat customer approval as the release gate for the remaining quantity.\n      <\/li>\n<li>\n        <strong>Release production.<\/strong><br \/>\n        Continue the lot with the approved process and traceability requirements.\n      <\/li>\n<\/ol>\n<p>\n      This dependency view also tells procurement what information matters when comparing quotes.\n    <\/p>\n<p>\n      A shorter headline turnaround has little value if it excludes a required test operation, assumes immediate<br \/>\n      component availability or begins counting only after unresolved documentation has been corrected.\n    <\/p>\n<h2>Prepare the quote package so the schedule can be real<\/h2>\n<p>\n      If your board is moving toward a time-sensitive prototype, pilot or production build, RLX reviews DFM\/DFA<br \/>\n      as part of every quote. Send the applicable Gerber, ODB++ or IPC-2581 data, NC drill, BOM, pick-and-place file,<br \/>\n      assembly drawing and supporting test information. Complete files can be quoted within 24 business hours, with<br \/>\n      lead time confirmed for the actual scope.\n    <\/p>\n<h2>FAQ<\/h2>\n<h3>Can I use ODB++ or IPC-2581 instead of Gerber files?<\/h3>\n<p>\n      Yes. Manufacturing data can be supplied as Gerber RS-274X, ODB++ or IPC-2581, with NC drill data as applicable.<br \/>\n      The better question is whether the package is internally consistent. Whichever format you choose, its revision<br \/>\n      should match the BOM, pick-and-place information, assembly drawing and other released manufacturing documentation.\n    <\/p>\n<h3>Do I have to supply every component for a quick-turn PCB assembly?<\/h3>\n<p>\n      No. A build can be turnkey, kitted or consigned. In a turnkey programme, procurement covers the components and<br \/>\n      bare boards. A kitted approach lets you supply selected critical or long-lead components while the remaining<br \/>\n      material is sourced. A consigned build uses a complete customer-supplied kit. The sourcing model should be fixed<br \/>\n      before scheduling.\n    <\/p>\n<h3>Is first article approval required before the rest of the lot is built?<\/h3>\n<p>\n      A first article is standard on every new build, with customer sign-off before production lot release. It gives<br \/>\n      engineering and production a controlled point to verify the physical assembly, workmanship and defined test<br \/>\n      results before the remaining units proceed. For a time-sensitive build, the approval step should be planned<br \/>\n      rather than treated as an unexpected pause.\n    <\/p>\n<h3>Can a quick-turn assembly include BGAs, LGAs and QFNs?<\/h3>\n<p>\n      Yes. Assembly supports fine-pitch devices including BGAs down to 0.3 mm pitch, and AXI is used for BGA, LGA<br \/>\n      and QFN thermal-pad inspection and void analysis. These packages affect more than placement capability. Their<br \/>\n      hidden solder joints change the inspection route, which should be included when the production schedule is<br \/>\n      prepared.\n    <\/p>\n<h3>What inspection is performed on an assembled PCB?<\/h3>\n<p>\n      The production flow can include 100% pre-reflow SPI for paste volume, area and offset, post-reflow AOI on both<br \/>\n      sides, AXI for applicable hidden-joint packages, and manual visual inspection to IPC-A-610 Class 2 or Class 3<br \/>\n      criteria. Electrical and functional testing are separate operations and should be specified according to the<br \/>\n      programme.\n    <\/p>\n<h3>How quickly can I receive a PCB assembly quote?<\/h3>\n<p>\n      A quote response is available within 24 business hours after complete files are received. &#8220;Complete&#8221; matters<br \/>\n      because the manufacturer needs enough information to review fabrication data, BOM content, placement information,<br \/>\n      drawings and the intended production scope. Assembly build lead time is then confirmed for that specific job<br \/>\n      rather than assumed from a generic quick-turn label.\n    <\/p>\n","protected":false},"excerpt":{"rendered":"<p>Quick-turn PCB assembly succeeds when the build is ready to manufacture before the clock starts: complete fabrication data, a clean [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":175,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"nf_dc_page":"","site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[17],"tags":[],"class_list":["post-176","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-assembly"],"_links":{"self":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/176","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/comments?post=176"}],"version-history":[{"count":0,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/posts\/176\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/media\/175"}],"wp:attachment":[{"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/media?parent=176"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/categories?post=176"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/rlxsolutions.com\/blog\/wp-json\/wp\/v2\/tags?post=176"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}