Schematic capture, multi-layer PCB layout, high-speed digital design, thermal and power management, and DFM review. A full engineering extension of your team — or a standalone layout service when your schematic is ready and you just need the layout.
PCB design and engineering covers schematic capture, multi-layer layout, signal and power integrity, thermal work, and DFM review. RLX Solutions provides engineering from concept to fabrication-ready files, with UL and CSA certification requirements built into the design from the start.
Some customers come with a concept and a requirements doc. Others arrive with a mature schematic and a stackup target. We meet the program wherever it is — from requirements capture and architecture through final fabrication package release — and hand off with build-ready files.
Every PCB we design is fabrication-aware. We know what the process allows, what it doesn't, and what pushes cost without improving the product. Our DFM feedback happens while the layout is in progress, not after the quote. Same for DFA — component placement decisions consider the pick-and-place envelope, stencil aperture, and test access from the first revision.
When the design is finished, it flows directly into RLX fabrication and assembly — or we release the files to your preferred manufacturer. Either way, you own the IP and the full design database.
Complete schematic design from requirements or block diagrams. Component selection, reference design adaptation, power-supply sizing, and interface definition.
2-layer through 24+ layer designs. Engineered stackups, controlled impedance routing, BGA fanout, escape-routing strategy.
DDR memory, SerDes, PCIe, USB 3.x, HDMI, Ethernet. Length matching, differential routing, via optimization, return-path management.
PDN design and analysis — plane capacitance, decoupling strategy, power plane layout for low impedance across frequency.
Component thermal budget, heat-spreading plane design, thermal via placement, heat sink interface. MCPCB stackup when thermal limits demand it.
Impedance-controlled RF traces, guard banding, shielding strategy, mixed-signal layout with proper ground and return-path separation.
Pre-compliance design review — common-mode chokes, filter placement, return-path continuity, shielding strategy. Often cheaper than re-spinning after test failure.
Flex geometry, bend radius design, coverlay management, stiffener placement, rigid-to-flex transition. Tested and verified before fabrication release.
Review of an existing design — DFM issues, signal integrity concerns, thermal risks, and BOM optimization. Delivered as a written report.
Design work that ends with a certified product — not a design-in-hand that still needs a compliance sprint.
Getting a product to market means getting it through UL or CSA. We design for compliance from the first schematic revision — creepage and clearance, component selection aligned with recognized component programs, insulation system choice, and PCB layout that conforms to the certification body's requirements for the target standard.
Our experience spans UL 508A industrial control panels, UL/CSA 60950 and 62368 information technology and audio/video equipment, UL/CSA 61010 laboratory and test equipment, UL 8750 LED equipment, and UL 1310 Class 2 power units. For each program we identify the applicable standard early, design to it, assemble the certification file alongside the product, and work directly with your chosen NRTL (UL, CSA, Intertek, TÃœV) through the evaluation.
When the work is done, you have a product ready for the field. Not a schematic that surprises you at submission.
You stay in your tool — we work in it or import cleanly and give you back native files.
Native
Native
Native
Import / Export
Import / Export
Import
Import / Export
Universal
Send requirements, a reference design, or a schematic-in-progress. We'll scope the engagement and come back with a proposal — fixed scope, T&M, or turnkey.