EMI & EMC PCB Design Guidelines
Electromagnetic interference (EMI) is controlled most effectively in the PCB layout, not after a compliance failure. Good electromagnetic compatibility (EMC)
BGA Rework vs Reballing: Process & When Each Is Used
BGA rework is the broader process of removing, preparing and reinstalling or replacing a ball grid array device, while reballing
PCB Copper Weight: 1 oz, 2 oz, 4 oz & Copper Thickness
PCB copper weight describes the nominal copper thickness produced when a specified mass of copper is spread over one square
Decoupling Capacitor Placement for PCB Power Integrity
Decoupling capacitor placement is a power integrity problem, not a distance-to-pin rule. The capacitor must provide a low-impedance current path
PCB Assembly Quote: Files, BOM & Manufacturing Requirements
A PCB assembly quote is only as accurate as the manufacturing package behind it. RLX Solutions, a contract electronics manufacturer
Blind, Buried & Microvias: Types, Uses & Manufacturing Cost
Blind vias connect an outer layer to one or more inner layers, buried vias connect only internal layers, and microvias
PCB Thermal Management: Heat Dissipation, Copper & Vias
PCB thermal management starts by giving heat a low-resistance path away from power components and hot spots. Copper area, copper
BGA Underfill: Materials, Process & Applications
BGA underfill is a polymer material placed beneath a ball grid array package to mechanically support the solder-joint array and
PCB Trace Width: Minimum Width, Spacing & Copper Thickness
PCB trace width and spacing cannot be specified independently of copper thickness. A geometry that is practical in 1 oz
PCB Design for Manufacturing: Complete DFM Guide
PCB design for manufacturing (DFM) means designing the printed circuit board around the fabrication, assembly and test processes that will