CANADIAN MANUFACTURER · EST. 2013

One partner for your electronics manufacturing.

RLX Solutions is a Canadian electronics manufacturer offering PCB fabrication, turnkey assembly, component procurement, custom cable and harness assembly, LED products, and engineering support. Incorporated in 2013, we're UL listed, ISO 9001:2015 certified, and built for regulated-industry work. One quote, one program manager, from prototype through sustained production.

Explore our capabilities QUOTE RESPONSE < 24 hrs
UL Listed File #E466570
ISO 9001:2015 Cert #C712619 · DNV
IPC Class 3 A-610 · J-STD-001
RoHS / REACH CE · CSA aligned
24/hr Quote response
01 — Why RLX

Offshore spec envelope. North American oversight.

We match the capability depth of large overseas prototype houses and pair it with Canadian-registered quality systems, real DFM review, and a supply chain your procurement team can audit.

01 / CERTIFIED

UL listed & ISO 9001:2015

UL #E466570 since 2013. ISO certificate #C712619 issued by DNV. IPC-A-610 Class 2 and Class 3 workmanship. Documents published on request.

02 / CAPABILITY

Full-spec manufacturing

Blind & buried vias, HDI microvias, rigid-flex, metal-core, controlled impedance, 01005 passives, 0.3 mm BGA pitch. See the capability reference below for the full envelope.

03 / ENGINEERING

Engineer-led DFM

Every quote gets a real DFM / DFA review before fabrication. No automated rubber-stamp, no wait for offshore clarification. Included, not extra.

04 / SUPPLY CHAIN

Procurement network

Authorized distribution plus verified excess-inventory sourcing for obsolete and allocated parts. Full lot and date-code traceability.

02 — Capability reference

What we can actually build.

The standard envelope of every service we offer, organized the way an engineer evaluates a manufacturer: PCB parameters, drilling, traces, via types, surface finishes, impedance, special processes, and test. Specs are our routine production envelope. Anything beyond — 28-layer stackups, sub-2 mil traces, copper in >6 oz, controlled impedance tighter than ±5% — is available on request. Ask.

// HOW TO USE THIS REFERENCE

Pick the process you need from the tabs. Check your design against the specs. If your file passes, it's a routine build. If it doesn't, tell us what's off — 90% of edge cases are builds we quote without issue.

// LEGEND Routineeveryday production · no engineering review needed Advancedengineered build · DFM review confirms feasibility On requestboundary capability · scoped per project
01.01

PCB parameters

FR-4, high-Tg, halogen-free substrates
Layer countRoutine
1 to 24 layers standardup to 40 on request
Board sizeRoutine
6 × 6 mm minimum · 500 × 600 mm maximum single-piece
Board thicknessRoutine
0.4 mm – 3.2 mm ±10% tolerance
Dimensional toleranceRoutine
±0.1 mm standard · ±0.05 mm precision
Base materialRoutine
FR-4 Tg 135°CFR-4 High-Tg 150 / 170 / 180°CHalogen-freeCEM-1 / CEM-3
Laminate manufacturersRoutine
Kingboard (KB-6160 / 6165F / 6167F)Nanya (NP-155F / 175F / NPG-170)IsolaShengyi (S1000-2 / S1141 / S1170G)ITEQ (IT-180A / IT-158)Ventec (VT-47 / VT-481)Panasonic (MEGTRON)
High-frequency laminatesAdvanced
Rogers RO4003C / RO4350BRogers RO3003 / RO3010Taconic TLY / RF-35Arlon 25N / 55NTPTFE / TeflonPolyimide
CTI ratingAdvanced
CTI 175 V / 250 V / 600 V available for high-voltage designs
01.02

Copper weight

Outer layersRoutine
0.5 oz / 1 oz / 2 oz / 3 oz standardup to 6 oz heavy copper on request
Inner layersRoutine
0.5 oz / 1 oz / 2 oz
Heavy copperOn request
4–6 oz outer, up to 3 oz inner for power conversion & high current
01.03

Drilling

Mechanical + laser
Min mechanical drillRoutine
0.15 mm (6 mil) plated through-hole
Min laser drill (microvia)Advanced
0.10 mm (4 mil) · stacked & staggered configurations
Max drillRoutine
6.5 mm mechanical
Hole toleranceRoutine
±0.08 mm plated (PTH) · ±0.05 mm non-plated (NPTH)
Min annular ringRoutine
0.075 mm (3 mil) inner · 0.1 mm (4 mil) outer
Max aspect ratioRoutine
10:1 standard · 12:1 on request
Slot holesRoutine
Plated from 0.65 mm · non-plated from 1.0 mm
01.04

Traces & spacing

Minimum by layer count
2-layer, 1 ozRoutine
3 mil / 3 mil trace width / spacing
2-layer, 2 ozRoutine
6 mil / 6 mil trace / spacing
4-layer, 1 oz outerRoutine
3 mil / 3 mil trace / spacing
6+ layerAdvanced
3 mil / 3 mil standard
HDI fine-lineOn request
2 mil / 2 mil on request selected sections, engineered stackup
Edge clearanceRoutine
0.3 mm copper-to-edge minimum
01.05

Via types

Through-hole (PTH)Routine
All layer counts, standard plating
Via-in-pad (POFV)Advanced
Resin fill + copper cap, planarized standard process for 4+ layers
Blind viasAdvanced
Sequential lamination · 4+ layer stackups
Buried viasAdvanced
Between any inner layer pair · 4+ layer stackups
Stacked & staggered microviasOn request
HDI builds · laser drilled, plated, filled, and capped
Button platingAdvanced
For BGA fanout and density optimization
01.06

Surface finish

RoHS and leaded options
HASL (tin-lead)Routine
Standard · most cost-effective · robust solderability
HASL lead-freeRoutine
RoHS compliant · SnCuNi alloy
ENIGRoutine
Ni 3–6 μm + Au 0.05–0.1 μm fine-pitch, BGA, long shelf
ENEPIGAdvanced
For wire bonding and extended shelf life
Immersion silverAdvanced
Flat surface · RoHS compliant
Immersion tinAdvanced
Press-fit and fine-pitch applications
OSPRoutine
Organic coating · cost-effective, single-reflow builds
Hard gold (gold fingers)Advanced
30 μ″ / 50 μ″ Au with bevel card-edge connectors
01.07

Solder mask

Colors
Green (fastest)BlueRedBlackWhiteYellowPurpleMatte GreenMatte Black
Type
LPI (Liquid Photo-Imageable) · thermal-cured
Thickness
10–25 μm
Min mask dam
0.08 mm (3 mil) between pads
Expansion
0.05 mm per side (default)
Peelable mask
Available for selective plating / rework protection
01.08

Silkscreen (legend)

Colors
White (standard) · Black (on white mask) · Yellow
Min line width
0.1 mm (4 mil)
Min character height
0.8 mm (32 mil)
Ink
Thermal-cured epoxy · UV-cured available
01.09

Impedance control

Single-endedAdvanced
25–120 Ω · microstrip, stripline, coplanar
DifferentialAdvanced
50–150 Ω · edge-coupled, dual coplanar
ToleranceAdvanced
±10% standard · ±5% on request
VerificationAdvanced
TDR test on coupon · full report with shipment
01.10

Outline & special processes

Outline tolerance
±0.1 mm standard · ±0.05 mm precision
V-cut
20° / 30° angle · panelization for SMT assembly
Tab route
With mouse-bite perforation · customer-specified tab positions
Castellated holes
Half-hole edge plating for module / daughtercard designs
Edge plating
Continuous copper on PCB edges for EMI / ground contact
Press-fit plating
Tight hole tolerance for connector insertion
Countersink / counterbore
Mechanical · custom angle and depth
Carbon paste / ink
Keypad contacts, jumpers, low-cost conductors
01.11

Testing & inspection

100% tested before ship
Electrical testRoutine
Flying probe (prototype) or bed-of-nails (production) · 100% tested
AOIRoutine
Post-etch inner layers · post-solder mask outer layers
X-ray (AXI)Advanced
For internal features and hidden layers on HDI builds
Cross-sectionOn request
Microsection on request · IPC-TM-650 methods
SolderabilityOn request
Per J-STD-003 on request
First article inspectionRoutine
AS9102 format available
01.12

Quality standards

Workmanship
IPC-A-600 acceptability · IPC-6012 Class 2 and Class 3
Design verification
IPC-2221 / IPC-2222 generic and sectional standards
Quality system
ISO 9001:2015 certified by DNV · Cert #C712619
UL listing
File #E466570 since 2013
Compliance
RoHS · REACH · CE · CSA alignment
02.01

Flex PCB parameters

Polyimide base
Layer count
1 to 8 layers flex
Base material
Polyimide (PI) · adhesive and adhesive-less laminate PET for cost-sensitive low-temp builds
Laminate manufacturersRoutine
DuPont Pyralux (AP / LF)Panasonic FELIOSShengyi SF305 / SF202ThinflexNikkan Nikaflex
PI thicknessRoutine
12.5 μm / 25 μm / 50 μm
Copper
Rolled-annealed (RA) · electrodeposited (ED) · 0.5 / 1 / 2 oz
CoverlayRoutine
PI + acrylic adhesive (25 μm + 25 μm typical) · LPI flexible solder mask option
StiffenersAdvanced
FR-4 · polyimide · stainless steel · aluminum
Min bend radiusAdvanced
6× substrate thickness (static) · 12× (dynamic flex)
Min trace / space
3 mil / 3 mil
02.02

Rigid-flex

FR-4 + polyimide hybrid
Total layer countAdvanced
Up to 12 layers (rigid + flex sections combined)
ConstructionAdvanced
Rigid FR-4 sections bonded to polyimide flex ribbon · single, asymmetric, or booked stackups
Flex-to-rigid transitionAdvanced
Controlled impedance options available · bookbinder construction for dynamic applications
Typical applications
Wearables · medical instruments · aerospace · folded compact packaging · camera modules
02.03

Surface finish & special

Finishes
ENIG (standard) · immersion tin · OSP · immersion silver · hard gold for fingers
EMI shieldingAdvanced
Silver paste screen print · copper foil shielding film · plated shielding
Transparent flexOn request
Clear PI substrate with printed conductive traces on request
Impedance
Controlled impedance in flex: available on request wider tolerance than rigid
03.01

Metal core parameters

Aluminum & copper core
Base metalRoutine
Aluminum 1100300350526061Copper C1100
Construction
Single-sided · double-sided · multi-layer MCPCB
Thermal conductivityRoutine
1.0 – 9.0 W/m·K dielectric (spec to application)
Dielectric thicknessRoutine
75 μm – 150 μm
Copper weight
1 oz – 10 oz
Board thickness
0.8 mm – 3.2 mm
Min hole size
0.5 mm mechanical drill
Min trace / space
6 mil / 6 mil
03.02

Finish & processes

Surface finish
HASL lead-free · ENIG · OSP · immersion silver
V-cut & routingRoutine
Standard · panelization for SMT assembly
Typical applications
LED lighting · power conversion · automotive electronics · motor drives · thermal-critical circuits
04.01

Component envelope

Packages we routinely place
SMT passivesRoutine
0100502010402060308051206121020102512
BGAAdvanced
Down to 0.3 mm pitch · up to 60 × 60 mm package
QFN / DFNRoutine
Standard and fine-pitch (0.4 mm) · thermal pad reflow with void control
QFP / TQFP / LQFPRoutine
All standard pitches · fine-pitch 0.4 mm
Leaded packagesRoutine
SOT · SOIC · SOP · SSOP · TSOP · LGA · CSP · PoP
Through-holeRoutine
Connectors · switches · power components · electromechanical parts · press-fit
04.02

PCB envelope

Min board sizeRoutine
10 × 10 mm
Max board sizeRoutine
500 × 500 mm
Board thickness
0.6 mm – 3.2 mm
PanelizationRoutine
V-cut · tab route with mouse-bites · scored break-away
04.03

Assembly processes

Surface mount (SMT)Routine
Single- and double-sided · stencil print, pick-and-place, reflow
Through-hole
Wave solder · selective solder · hand solder for low-volume / complex
Mixed technologyRoutine
SMT + through-hole on same assembly
Solder alloysRoutine
SAC305 lead-free (standard) · Sn63Pb37 tin-lead (on request) · low-temp alloys available
Reflow profilingRoutine
10-zone convection · thermocouple profile verification · nitrogen reflow available
Press-fit insertionAdvanced
Tool-assisted · DIN connector standards
04.04

Inspection

SPI + AOI + X-ray + manual
SPIRoutine
Solder Paste Inspection · 100% pre-reflow coverage
AOI
Post-reflow, both sides · placement, orientation, solder joint verification
AXI (X-ray)
BGA, LGA, QFN thermal pads · void inspection · hidden joint verification
Manual visualRoutine
Per IPC-A-610 Class 2 or Class 3 criteria
First article (FAI)Routine
On every new build · customer-signed approval before production lot
04.05

Test

Flying probe (ICT)Routine
Prototype and low-volume · no fixture required
Bed-of-nails ICTAdvanced
Production volume · customer-supplied or RLX-developed fixture
Functional test (FCT)Advanced
To customer specification · pass / fail logging with traceability
Boundary scan (JTAG)Advanced
For BGA / QFN coverage where ICT can't reach
Burn-inOn request
Environmental stress screening on request
04.06

Programming & marking

In-system programmingAdvanced
ISP / ICSP through customer programming header
JTAG / SWDAdvanced
Boundary-scan programming and verification
Bootloader / firmwareAdvanced
Customer firmware flashed and verified per build
SerializationAdvanced
Serial number marking · MAC address programming · customer-defined schema
Label & mark
Laser mark · inkjet · label print · barcode / QR code
04.07

Special processes

Conformal coatingAdvanced
Acrylic · silicone · polyurethane · parylene selective or full-PCB
UnderfillAdvanced
Capillary flow and no-flow · BGA and CSP reinforcement
Potting / encapsulationAdvanced
Custom-mold potting · environmental protection
BGA reworkAdvanced
Removal, reballing, replacement · X-ray verified
Solder dippingOn request
Tin whisker mitigation · lead-tin conversion
Cable & harness integrationAdvanced
On-assembly wire harness termination · connectorization
04.08

Process controls

ESDRoutine
ANSI/ESD S20.20 aligned · EPA work zones · wrist-strap / footwear / floor monitoring
MSD handlingRoutine
Per IPC/JEDEC J-STD-033 · dry-cabinet storage · bake-out before reflow
SolderingRoutine
J-STD-001 Class 2 and Class 3 trained operators
Stencil managementRoutine
Laser-cut stencils · 0.08 mm – 0.15 mm standard · step-stencils on request
TraceabilityRoutine
Full component lot / date code capture to serial number · retained per ISO 9001 schedule
04.09

Quality standards

Workmanship
IPC-A-610 Class 2 and Class 3
Soldering
J-STD-001 Class 2 and Class 3
Quality system
ISO 9001:2015 · DNV Cert #C712619
UL
File #E466570
03 — The work

PCB technologies we ship every week.

04 — Solutions

Eight services, one point of contact.

Request any service standalone or bundle them into a turnkey program. We coordinate the handoffs so you manage one quote and one program manager.

01

PCB Manufacturing

Bare PCB fabrication — FR-4, high-Tg, halogen-free, aluminum MCPCB, rigid-flex, polyimide, HDI, high-frequency. 1–24 layers standard.

View capabilities
02

PCB Assembly (PCBA)

Turnkey SMT, through-hole, and mixed-tech assembly. 01005 passives, 0.3 mm BGA pitch, conformal coat, functional test.

View capabilities
03

Component Procurement

Obsolete, allocated, and hard-to-find parts. Authorized distribution plus verified excess-inventory sources. Full lot traceability.

View capabilities
04

Custom Component Build

Custom capacitors, industrial relay sockets, electronic packaging, terminal blocks, electro-mechanical interconnects.

View capabilities
05

Engineering & Design

Schematic capture, multi-layer layout, high-speed digital, thermal and power management. DFM / DFA review included.

View capabilities
06

Custom Cable Assembly

Wire harnesses and custom cable assemblies for industrial, military, and medical applications. Crimping, over-molding, potting.

View capabilities
07

In-Stock Inventory

Searchable live inventory of electronic components. List your excess stock, or find the parts you need now.

Browse inventory
05 — Certifications

Our certifications.

RLX Solutions ISO 9001:2015 certificate issued by DNV
CERT / 01

ISO 9001:2015

Certificate #C712619 · Issued by DNV
UL listing card for RLX Solutions file E466570
CERT / 02

UL Listed

File #E466570 · Since 2013
IPC industry standards mark
CERT / 03

IPC-A-610 & J-STD-001

Class 2 & Class 3 workmanship · RoHS · REACH · CE · CSA aligned
Scope letters on request
06 — Industries

Where our PCBs end up.

01
Medical Devices
IPC Class 3 · full traceability · low-PPM targets
02
Telecommunications
High-frequency · HDI · controlled impedance
03
Life-Safety
UL-aligned · Class 3 workmanship
04
Industrial
Long lifecycle · harsh environments
05
Consumer Electronics
Cost-optimized volume production
06
Hardware Startups
Prototype through pilot production
07 — Get started

Request a quote. Response in 24 hours.

Send Gerbers, BOM, and pick-and-place files. An engineer on our team reviews and responds with a real quote, DFM feedback, and timeline.

  • [+] Response within 24 business hours
  • [+] Engineer-reviewed DFM feedback included, no charge
  • [+] Files held under NDA — signed copy available on request
  • [+] Prefer to talk first? Call +1 416 953 1620
// TWO WAYS TO REACH US
Request a quote Email sales@rlxsolutions.com
UL #E466570 · ISO 9001:2015 · IPC CLASS 3
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